Hsuan Jui Chang

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing patterned metal nanowires, electrode using the...
- Patent number 9,530,652
- Issue date Dec 27, 2016
- NATIONAL TAIWAN UNIVERSITY
- Hsuan-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package with cooling arrangement
- Patent number 6,567,270
- Issue date May 20, 2003
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for making a metal bump with an increased height
- Patent number 6,499,648
- Issue date Dec 31, 2002
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming cylindrical bumps on a substrate for integrated c...
- Patent number 6,390,356
- Issue date May 21, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on wafers or substrates
- Patent number 6,358,834
- Issue date Mar 19, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing thin ball grid array substrates
- Patent number 6,274,491
- Issue date Aug 14, 2001
- Orient Semiconductor Electronics Limited
- Wan Le Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PRODUCING PATTERNED METAL NANOWIRES, ELECTRODE USING THE...
- Publication number 20160218009
- Publication date Jul 28, 2016
- National Taiwan University
- Hsuan-Chun CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF CRYSTALLIZED TRANSPARENT CONDUCTING OXIDES ON...
- Publication number 20120012454
- Publication date Jan 19, 2012
- NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY
- Yian Tai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Fabrication method of semiconductor
- Publication number 20030059721
- Publication date Mar 27, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package with cooling arrangement
- Publication number 20030035270
- Publication date Feb 20, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for making a metal bump with an increased height
- Publication number 20030006268
- Publication date Jan 9, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT
- Publication number 20020179686
- Publication date Dec 5, 2002
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for multilayer high density substrate
- Publication number 20020072216
- Publication date Jun 13, 2002
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS

Hsuan Jui Chang

Person

Patents Grantslast 30 patents

Method for producing patterned metal nanowires, electrode using the...

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

Method of forming cylindrical bumps on a substrate for integrated c...

Method of forming bumps on wafers or substrates

Process of manufacturing thin ball grid array substrates

Patents Applicationslast 30 patents

METHOD FOR PRODUCING PATTERNED METAL NANOWIRES, ELECTRODE USING THE...

FABRICATION METHOD OF CRYSTALLIZED TRANSPARENT CONDUCTING OXIDES ON...

Fabrication method of semiconductor

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT

Manufacturing method for multilayer high density substrate