Hsuan-Tai Hsu

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating semiconductor device
- Patent number 11,462,441
- Issue date Oct 4, 2022
- United Microelectronics Corp.
- Shih-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact hole structure and method of fabricating the same
- Patent number 10,483,158
- Issue date Nov 19, 2019
- United Microelectronics Corp.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact hole structure and method of fabricating the same
- Patent number 10,199,260
- Issue date Feb 5, 2019
- United Microelectronics Corp.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20220189770
- Publication date Jun 16, 2022
- UNITED MICROELECTRONICS CORP.
- Shih-Wei Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT HOLE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20190122920
- Publication date Apr 25, 2019
- UNITED MICROELECTRONICS CORP.
- Po-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS