Hsueh-Chung Shelton Lu

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Chip package array, and chip package
- Patent number 11,227,848
- Issue date Jan 18, 2022
- VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package process
- Patent number 11,081,371
- Issue date Aug 3, 2021
- VIA ALLIANCE SEMICONDUCTOR CO., LTD.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging method
- Patent number 10,756,077
- Issue date Aug 25, 2020
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and chip package structure array
- Patent number 10,504,847
- Issue date Dec 10, 2019
- SHANGHAI ZHAOXIN SEMICONDUCTOR CO., LTD.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip and manufacturing method and application thereof
- Patent number 7,504,726
- Issue date Mar 17, 2009
- VIA Technologies, Inc.
- Kwun-Yao Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip bump arrangement for decreasing impedance
- Patent number 6,680,544
- Issue date Jan 20, 2004
- VIA Technologies, Inc.
- Hsueh-Chung Shelton Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE STRUCTURE AND CHIP PACKAGE STRUCTURE ARRAY
- Publication number 20190139898
- Publication date May 9, 2019
- Shanghai Zhaoxin Semiconductor Co., Ltd.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING METHOD
- Publication number 20190139952
- Publication date May 9, 2019
- Shanghai Zhaoxin Semiconductor Co., Ltd.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ARRAY, AND CHIP PACKAGE
- Publication number 20180061788
- Publication date Mar 1, 2018
- VIA Alliance Semiconductor Co., Ltd.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE PROCESS
- Publication number 20180061672
- Publication date Mar 1, 2018
- VIA Alliance Semiconductor Co., Ltd.
- Wen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MANUFACTURING METHOD AND APPLICATION THEREOF
- Publication number 20080122077
- Publication date May 29, 2008
- VIA TECHNOLOGIES, INC.
- Kwun-Yao Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip-chip bump arrangement for decreasing impedance
- Publication number 20020190390
- Publication date Dec 19, 2002
- Via Technologies, Inc.
- Hsueh-Chung Shelton Lu
- H01 - BASIC ELECTRIC ELEMENTS