Hsun-Li Huang

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 12,191,327
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated chip for standard logic performance improvement having a...
- Patent number 12,142,569
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including light shielding layer and patterned dielectr...
- Patent number 12,081,866
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,068,271
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a butted contact and method of forming
- Patent number 12,010,826
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- You Che Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,855,118
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 11,843,007
- Issue date Dec 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 11,824,073
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anchor structures and methods for uniform wafer planarization and b...
- Patent number 11,817,472
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked substrate structure with inter-tier interconnection
- Patent number 11,817,470
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide channel semiconductor device
- Patent number 11,784,198
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,756,913
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including light shielding layer and patterned dielectr...
- Patent number 11,706,525
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a butted contact, method of forming and...
- Patent number 11,610,901
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- You Che Chuang
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of forming image sensor device
- Patent number 11,532,662
- Issue date Dec 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,456,263
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide channel gate structure
- Patent number 11,380,721
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,373,971
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Chi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with improved quantum efficiency surface structure
- Patent number 11,302,738
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with back-side layer to reduce leakage
- Patent number 11,244,925
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of light sensing device
- Patent number 11,233,082
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single photon avalanche diode
- Patent number 11,189,743
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with improved quantum efficiency surface structure
- Patent number 11,189,657
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor having indented photodiode structure
- Patent number 11,183,523
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating image sensor
- Patent number 11,177,305
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with pad structure
- Patent number 11,177,309
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming light-sensing device
- Patent number 11,177,304
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies with a conductive feature passing throug...
- Patent number 11,177,307
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor having isolation structure
- Patent number 11,164,902
- Issue date Nov 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240371810
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING
- Publication number 20240324162
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You Che CHUANG
- G11 - INFORMATION STORAGE
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240088195
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
- Publication number 20240063234
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20240038804
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION
- Publication number 20240021645
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anchor Structures And Methods For Uniform Wafer Planarization And B...
- Publication number 20230387172
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230378115
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE CHANNEL SEMICONDUCTOR DEVICE
- Publication number 20230378205
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING LIGHT SHIELDING LAYER AND PATTERNED DIELECTR...
- Publication number 20230308755
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT AND METHOD OF FORMING
- Publication number 20230225099
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You Che CHUANG
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20230118159
- Publication date Apr 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220367391
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20220310544
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE CHANNEL SEMICONDUCTOR DEVICE
- Publication number 20220293650
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor With Improved Quantum Efficiency Surface Structure
- Publication number 20220231075
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- YUN-WEI CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SENSING DEVICE WITH FILTER ELEMENT
- Publication number 20220109019
- Publication date Apr 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE
- Publication number 20220077206
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANCHOR STRUCTURES AND METHODS FOR UNIFORM WAFER PLANARIZATION AND B...
- Publication number 20220052100
- Publication date Feb 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INCLUDING LIGHT SHIELDING LAYER AND PATTERNED DIELECTR...
- Publication number 20220030158
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20210407947
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Chi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20210366967
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun-Wei CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...
- Publication number 20210351134
- Publication date Nov 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION
- Publication number 20210313376
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jeng-Shyan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING IMAGE SENSOR DEVICE
- Publication number 20210202564
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT, METHOD OF FORMING AND...
- Publication number 20210091091
- Publication date Mar 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- You Che CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20200402954
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH A CONDUCTIVE FEATURE PASSING TH...
- Publication number 20200395398
- Publication date Dec 17, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR HAVING ISOLATION STRUCTURE
- Publication number 20200343282
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20200321294
- Publication date Oct 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS

Hsun-Li Huang

Person

Patents Grantslast 30 patents

CMOS image sensor having indented photodiode structure

Integrated chip for standard logic performance improvement having a...

Image sensor including light shielding layer and patterned dielectr...

Semiconductor device structure and methods of forming the same

Semiconductor device having a butted contact and method of forming

Semiconductor structure

Image sensor device

CMOS image sensor having indented photodiode structure

Image sensor device

Anchor structures and methods for uniform wafer planarization and b...

Stacked substrate structure with inter-tier interconnection

Wide channel semiconductor device

Semiconductor device structure and methods of forming the same

Image sensor including light shielding layer and patterned dielectr...

Semiconductor device having a butted contact, method of forming and...

Method of forming image sensor device

Semiconductor structure and method for forming the same

Wide channel gate structure

Semiconductor device structure and methods of forming the same

Image sensor with improved quantum efficiency surface structure

Semiconductor device structure with back-side layer to reduce leakage

Formation method of light sensing device

Single photon avalanche diode

Image sensor with improved quantum efficiency surface structure

CMOS image sensor having indented photodiode structure

Method for fabricating image sensor

Image sensor with pad structure

Method for forming light-sensing device

Stacked semiconductor dies with a conductive feature passing throug...

Image sensor having isolation structure

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING A BUTTED CONTACT AND METHOD OF FORMING

IMAGE SENSOR DEVICE

CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE

IMAGE SENSOR DEVICE

STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION

Anchor Structures And Methods For Uniform Wafer Planarization And B...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

WIDE CHANNEL SEMICONDUCTOR DEVICE

IMAGE SENSOR INCLUDING LIGHT SHIELDING LAYER AND PATTERNED DIELECTR...

SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT AND METHOD OF FORMING

IMAGE SENSOR DEVICE

SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

WIDE CHANNEL SEMICONDUCTOR DEVICE

Image Sensor With Improved Quantum Efficiency Surface Structure

LIGHT SENSING DEVICE WITH FILTER ELEMENT

CMOS IMAGE SENSOR HAVING INDENTED PHOTODIODE STRUCTURE

ANCHOR STRUCTURES AND METHODS FOR UNIFORM WAFER PLANARIZATION AND B...

IMAGE SENSOR INCLUDING LIGHT SHIELDING LAYER AND PATTERNED DIELECTR...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

IMAGE SENSOR DEVICE

STRUCTURE FOR STANDARD LOGIC PERFORMANCE IMPROVEMENT HAVING A BACK-...

STACKED SUBSTRATE STRUCTURE WITH INTER-TIER INTERCONNECTION

METHOD OF FORMING IMAGE SENSOR DEVICE

SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT, METHOD OF FORMING AND...

SEMICONDUCTOR DEVICE STRUCTURE

SEMICONDUCTOR DEVICE STRUCTURE WITH A CONDUCTIVE FEATURE PASSING TH...

IMAGE SENSOR HAVING ISOLATION STRUCTURE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME