Hsyun-Ying Chan

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Hsin Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
High temperature process chamber having improved heat endurance
- Patent number 6,485,605
- Issue date Nov 26, 2002
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Liang Tseng
- H01 - BASIC ELECTRIC ELEMENTS