Hu Kwok Seng

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for packaging circuits
- Patent number 7,675,169
- Issue date Mar 9, 2010
- Micron Technology, Inc.
- Chia Yong Poo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR PACKAGING CIRCUITS
- Publication number 20080054423
- Publication date Mar 6, 2008
- Micron Technology, Inc.
- Chia Y. Poo
- H01 - BASIC ELECTRIC ELEMENTS