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Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING SAME
- Publication number 20240413059
- Publication date Dec 12, 2024
- JCET GROUP CO., LTD.
- Lei ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY MOLDING COMPOUNDS, PREPARATION METHOD THEREOF, AND USE THEREOF
- Publication number 20230212386
- Publication date Jul 6, 2023
- JCET GROUP CO., LTD.
- XINWEN WEI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...