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Kaohsiung City, TW
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Patents Grants
last 30 patents
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Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
Patent number
8,530,344
Issue date
Sep 10, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing fine-pitch bumps and structure thereof
Patent number
8,501,614
Issue date
Aug 6, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130256882
Publication date
Oct 3, 2013
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130249089
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING FINE-PITCH BUMPS AND STRUCTURE THEREOF
Publication number
20130249081
Publication date
Sep 26, 2013
Chipbond Technology Corporation
Cheng-Hung Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BUMPING PROCESS
Publication number
20130183823
Publication date
Jul 18, 2013
Chipbond Technology Corporation
Chih-Ming Kuo
H01 - BASIC ELECTRIC ELEMENTS