Hua Hong TAN

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
System and method of cleaning and inspecting semiconductor die carrier
- Patent number 11,945,004
- Issue date Apr 2, 2024
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- B08 - CLEANING
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 11,710,681
- Issue date Jul 25, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip bond semiconductor packages and assembly tools
- Patent number 11,676,934
- Issue date Jun 13, 2023
- UTAC HEADQUARTERS PTE. LTD.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliable semiconductor packages
- Patent number 11,177,301
- Issue date Nov 16, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bonding layer with spacers between a package substrate a...
- Patent number 11,145,575
- Issue date Oct 12, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Tanawan Chaowasakoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 11,139,233
- Issue date Oct 5, 2021
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity wall structure for semiconductor packaging
- Patent number 10,707,161
- Issue date Jul 7, 2020
- UTAC HEADQUARTERS PTE. LTD.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 10,354,934
- Issue date Jul 16, 2019
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,978,658
- Issue date May 22, 2018
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of packaging semiconductor devices
- Patent number 9,508,623
- Issue date Nov 29, 2016
- UTAC HEADQUARTERS PTE. LTD.
- Nathapong Suthiwongsunthorn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of manufacture
- Patent number 7,678,610
- Issue date Mar 16, 2010
- UTAC - United Test and Assembly Test Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240234195
- Publication date Jul 11, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Substrate with Improved...
- Publication number 20240136217
- Publication date Apr 25, 2024
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Cleaning and Inspecting Semiconductor Die Carrier
- Publication number 20230058682
- Publication date Feb 23, 2023
- UTAC Headquarters Pte. Ltd.
- Hua Hong Tan
- B08 - CLEANING
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20220028762
- Publication date Jan 27, 2022
- UTAC Headquarters Pte. Ltd.
- Tanawan CHAOWASAKOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS
- Publication number 20210118840
- Publication date Apr 22, 2021
- UTAC Headquarters Pte. Ltd.
- Albert Louis Bove
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WALL STRUCTURE FOR SEMICONDUCTOR PACKAGING
- Publication number 20200321273
- Publication date Oct 8, 2020
- UTAC Headquarters Pte. Ltd.
- Hua Hong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE SEMICONDUCTOR PACKAGES
- Publication number 20200161351
- Publication date May 21, 2020
- UTAC Headquarters Pte. Ltd.
- Hua Hong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20200144162
- Publication date May 7, 2020
- UTAC Headquarters Pte. Ltd.
- Tanawan CHAOWASAKOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAVITY WALL STRUCTURE FOR SEMICONDUCTOR PACKAGING
- Publication number 20190043797
- Publication date Feb 7, 2019
- UTAC Headquarters Pte. Ltd.
- Hua Hong TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20180240726
- Publication date Aug 23, 2018
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20170077007
- Publication date Mar 16, 2017
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES
- Publication number 20150357256
- Publication date Dec 10, 2015
- UTAC Headquarters Pte. Ltd.
- Nathapong SUTHIWONGSUNTHORN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20080251938
- Publication date Oct 16, 2008
- UTAC - United Test and Assembly Center LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method of manufacture
- Publication number 20060192292
- Publication date Aug 31, 2006
- UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Hua Hong TAN

Person

Patents Grantslast 30 patents

System and method of cleaning and inspecting semiconductor die carrier

Semiconductor packages and methods of packaging semiconductor devices

Clip bond semiconductor packages and assembly tools

Reliable semiconductor packages

Conductive bonding layer with spacers between a package substrate a...

Cavity wall structure for semiconductor packaging

Cavity wall structure for semiconductor packaging

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor chip package and method of manufacture

Patents Applicationslast 30 patents

Semiconductor Device and Method of Making a Substrate with Improved...

Semiconductor Device and Method of Making a Substrate with Improved...

System and Method of Cleaning and Inspecting Semiconductor Die Carrier

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

CLIP BOND SEMICONDUCTOR PACKAGES AND ASSEMBLY TOOLS

CAVITY WALL STRUCTURE FOR SEMICONDUCTOR PACKAGING

RELIABLE SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

CAVITY WALL STRUCTURE FOR SEMICONDUCTOR PACKAGING

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES AND METHODS OF PACKAGING SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

Semiconductor chip package and method of manufacture