Hua-Hsin Su

Person

Zhongli City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon photonics optical transceiver device
- Patent number 12,007,612
- Issue date Jun 11, 2024
- WAVESPLITTER TECHNOLOGIES, INC.
- Ming-Ju Chen
- G02 - OPTICS
Information Patent Grant
Heat dissipation structure of horizontal optical-communication sub-...
- Patent number 10,656,355
- Issue date May 19, 2020
- LUXNET CORPORATION
- Pi-Cheng Law
- G02 - OPTICS
Information Patent Grant
Optical transmitter with a heat dissipation structure
- Patent number 9,991,674
- Issue date Jun 5, 2018
- LUXNET CORPORATION
- Pi-Cheng Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible printed circuit and printed circuit board soldered structure
- Patent number 9,854,674
- Issue date Dec 26, 2017
- LUXNET CORPORATION
- Ho-I Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-end driving, high-frequency sub-substrate structure and high-fr...
- Patent number 9,847,307
- Issue date Dec 19, 2017
- LUXNET CORPORATION
- Ho-I Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Optical transmitter package structure
- Patent number 9,400,359
- Issue date Jul 26, 2016
- LUXNET CORPORATION
- Chung Hsin Fu
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SILICON PHOTONICS OPTICAL TRANSCEIVER DEVICE
- Publication number 20230161122
- Publication date May 25, 2023
- WAVESPLITTER TECHNOLOGIES, INC.
- Ming-Ju Chen
- G02 - OPTICS
Information Patent Application
HEAT DISSIPATION STRUCTURE OF HORIZONTAL OPTICAL-COMMUNICATION SUB-...
- Publication number 20190361181
- Publication date Nov 28, 2019
- LuxNet Corporation
- PI-CHENG LAW
- G02 - OPTICS
Information Patent Application
ASSEMBLY OF SEMICONDUCTOR AND HIGHLY THERMALLY CONDUCTIVE HEAT-DISS...
- Publication number 20180248336
- Publication date Aug 30, 2018
- LUXNET CORPORATION
- Hsing-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE HEAT-DISSIPATING SUBSTRATE
- Publication number 20180190520
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Hsing-Yen LIN
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
OPTICAL COMMUNICATION MODULE CONFIGURED FOR ENHANCING OPTICAL COUPL...
- Publication number 20180188458
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Pi-Cheng LAW
- G02 - OPTICS
Information Patent Application
OPTICAL COMMUNICATION MODULE CONFIGURED FOR ENHANCING OPTICAL COUPL...
- Publication number 20180188457
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Pi-Cheng Law
- G02 - OPTICS
Information Patent Application
HEAT-DISSIPATING SEMICONDUCTOR ASSEMBLY
- Publication number 20180191131
- Publication date Jul 5, 2018
- LUXNET CORPORATION
- Hsing-Yen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSMITTER WITH A HEAT DISSIPATION STRUCTURE
- Publication number 20180019569
- Publication date Jan 18, 2018
- LUXNET CORPORATION
- Pi-Cheng LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSMITTING DEVICE PACKAGE STRUCTURE
- Publication number 20150253520
- Publication date Sep 10, 2015
- LUXNET CORPORATION
- Yun-Cheng Huang
- G02 - OPTICS
Information Patent Application
SURFACE MOUNT LIGHT EMITTING DIODE PACKAGE
- Publication number 20080042157
- Publication date Feb 21, 2008
- FORMOSA EPITAXY INCORPORATION
- HUA-HSIN SU
- H01 - BASIC ELECTRIC ELEMENTS

Hua-Hsin Su

Person

Patents Grantslast 30 patents

Silicon photonics optical transceiver device

Heat dissipation structure of horizontal optical-communication sub-...

Optical transmitter with a heat dissipation structure

Flexible printed circuit and printed circuit board soldered structure

Two-end driving, high-frequency sub-substrate structure and high-fr...

Optical transmitter package structure

Patents Applicationslast 30 patents

SILICON PHOTONICS OPTICAL TRANSCEIVER DEVICE

HEAT DISSIPATION STRUCTURE OF HORIZONTAL OPTICAL-COMMUNICATION SUB-...

ASSEMBLY OF SEMICONDUCTOR AND HIGHLY THERMALLY CONDUCTIVE HEAT-DISS...

COMPOSITE HEAT-DISSIPATING SUBSTRATE

OPTICAL COMMUNICATION MODULE CONFIGURED FOR ENHANCING OPTICAL COUPL...

OPTICAL COMMUNICATION MODULE CONFIGURED FOR ENHANCING OPTICAL COUPL...

HEAT-DISSIPATING SEMICONDUCTOR ASSEMBLY

OPTICAL TRANSMITTER WITH A HEAT DISSIPATION STRUCTURE

TRANSMITTING DEVICE PACKAGE STRUCTURE

SURFACE MOUNT LIGHT EMITTING DIODE PACKAGE