Hua Ji

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Atomic layer deposition method and semiconductor device formed by t...
- Patent number 8,273,639
- Issue date Sep 25, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition method and semiconductor device formed by t...
- Patent number 8,158,512
- Issue date Apr 17, 2012
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition method and semiconductor device formed by t...
- Patent number 7,709,386
- Issue date May 4, 2010
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR NON-VOLATILE MEMORY DEVICE
- Publication number 20120168853
- Publication date Jul 5, 2012
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition Method and Semiconductor Device Formed by t...
- Publication number 20080315293
- Publication date Dec 25, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition Method and Semiconductor Device Formed by t...
- Publication number 20080315292
- Publication date Dec 25, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Atomic Layer Deposition Method and Semiconductor Device Formed by t...
- Publication number 20080315295
- Publication date Dec 25, 2008
- Semiconductor Manufacturing International (Shanghai) Corporation
- Hua Ji
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...