Hua Pan

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
First electrical connector, second electrical connector and electri...
- Patent number 12,191,603
- Issue date Jan 7, 2025
- Molex, LLC
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector
- Patent number D1032529
- Issue date Jun 25, 2024
- Molex, LLC
- Hua Pan
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Electrical connector
- Patent number D1031656
- Issue date Jun 18, 2024
- Molex, LLC
- Hua Pan
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 10,504,823
- Issue date Dec 10, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,685,430
- Issue date Jun 20, 2017
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device with small contact footprint and the pre...
- Patent number 9,646,920
- Issue date May 9, 2017
- ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN), LTD
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded package and method thereof
- Patent number 9,269,699
- Issue date Feb 23, 2016
- Alpha and Omega Semiconductor Incorporated
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making stacked multi-chip packaging structure
- Patent number 9,230,949
- Issue date Jan 5, 2016
- Alpha and Omega Semiconductor Incorporated
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip packaging structure and manufacturing method the...
- Patent number 9,006,870
- Issue date Apr 14, 2015
- Alpha and Omega Semiconductor Inc.
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum alloy lead-frame and its use in fabrication of power semic...
- Patent number 8,703,545
- Issue date Apr 22, 2014
- Alpha & Omega Semiconductor, Inc.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and fabricating method thereof
- Patent number 8,039,946
- Issue date Oct 18, 2011
- ChipMOS Technologies (Shanghai) Ltd.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIRST ELECTRICAL CONNECTOR, SECOND ELECTRICAL CONNECTOR AND ELECTRI...
- Publication number 20220393402
- Publication date Dec 8, 2022
- Molex, LLC
- Hua PAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20170186675
- Publication date Jun 29, 2017
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20160099238
- Publication date Apr 7, 2016
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...
- Publication number 20150357268
- Publication date Dec 10, 2015
- Alpha and Omega Semiconductor (Cayman), Ltd
- Hongtao Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED PACKAGE AND METHOD THEREOF
- Publication number 20150325559
- Publication date Nov 12, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE
- Publication number 20150179626
- Publication date Jun 25, 2015
- ALPHA & OMEGA SEMICONDUCTOR INCORPORATED
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...
- Publication number 20150035129
- Publication date Feb 5, 2015
- Xiaotian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMIC...
- Publication number 20130221507
- Publication date Aug 29, 2013
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20100078801
- Publication date Apr 1, 2010
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20100078802
- Publication date Apr 1, 2010
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF
- Publication number 20080012106
- Publication date Jan 17, 2008
- CHIPMOS TECHNOLOGIES(SHANGHAI) LTD.
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

First electrical connector, second electrical connector and electri...

Electrical connector

Electrical connector

Power semiconductor device with small contact footprint and the pre...

Embedded package and method thereof

Power semiconductor device with small contact footprint and the pre...

Embedded package and method thereof

Method of making stacked multi-chip packaging structure

Stacked multi-chip packaging structure and manufacturing method the...

Aluminum alloy lead-frame and its use in fabrication of power semic...

Chip package structure and fabricating method thereof

Patents Applicationslast 30 patents

FIRST ELECTRICAL CONNECTOR, SECOND ELECTRICAL CONNECTOR AND ELECTRI...

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

EMBEDDED PACKAGE AND METHOD THEREOF

POWER SEMICONDUCTOR DEVICE WITH SMALL CONTACT FOOTPRINT AND THE PRE...

EMBEDDED PACKAGE AND METHOD THEREOF

METHOD OF MAKING STACKED MULTI-CHIP PACKAGING STRUCTURE

STACKED MULTI - CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD T...

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

ALUMINUM ALLOY LEAD-FRAME AND ITS USE IN FABRICATION OF POWER SEMIC...

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF