Hua-Sheng Chen

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,908,735
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation structure for image sensors
- Patent number 11,862,654
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs and methods forming same
- Patent number 11,862,708
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure of a semiconductor device
- Patent number 11,854,875
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure with controlled air gaps
- Patent number 11,804,402
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,721,763
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having a liner layer w...
- Patent number 11,545,390
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 11,404,309
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fins with different dielectric constants and sizes in di...
- Patent number 11,282,751
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET isolation structure and method for fabricating the same
- Patent number 11,251,181
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liner layer with a configured profile
- Patent number 11,217,477
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs and methods forming same
- Patent number 10,930,752
- Issue date Feb 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structure with controlled air gaps
- Patent number 10,879,110
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate resistor and method of making same
- Patent number 10,872,963
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,872,980
- Issue date Dec 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source and drain dislocation fabrication in FinFETs
- Patent number RE48304
- Issue date Nov 10, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhiqiang Wu
Information Patent Grant
Method for integrated circuit patterning
- Patent number 10,727,061
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a liner layer with a configured profile...
- Patent number 10,720,358
- Issue date Jul 21, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source module and surface light source assembly thereof
- Patent number 10,670,791
- Issue date Jun 2, 2020
- Coretronic Corporation
- Hua Chen
- G02 - OPTICS
Information Patent Grant
Vias for cobalt-based interconnects and methods of fabrication thereof
- Patent number 10,553,481
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs and methods forming same
- Patent number 10,516,030
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET isolation structure and method for fabricating the same
- Patent number 10,510,751
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fault isolation system and method for detecting faults in a circuit
- Patent number 10,393,801
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Wei-Chih Wang
- G01 - MEASURING TESTING
Information Patent Grant
Surface light source assembly having light guide with groove struct...
- Patent number 10,386,565
- Issue date Aug 20, 2019
- Coretronic Corporation
- Hua Chen
- G02 - OPTICS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 10,332,786
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall spacers for self-aligned contacts
- Patent number 10,304,942
- Issue date May 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jyun-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate resistor and method of making same
- Patent number 10,297,669
- Issue date May 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-contact measurement device for radius of curvature and thicknes...
- Patent number 10,260,988
- Issue date Apr 16, 2019
- National Applied Research Laboratories
- Wei-Yao Hsu
- G01 - MEASURING TESTING
Information Patent Grant
FinFET structure with controlled air gaps
- Patent number 10,074,558
- Issue date Sep 11, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated circuit patterning
- Patent number 9,941,125
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Lin Yang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dielectric Fins With Different Dielectric Constants and Sizes in Di...
- Publication number 20240379452
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20240194525
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240154008
- Publication date May 9, 2024
- Industrial Technology Research Institute
- Chih-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20240096697
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS AND METHODS FORMING SAME
- Publication number 20240072155
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS
- Publication number 20240021644
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURE WITH CONTROLLED AIR GAPS
- Publication number 20230386904
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT
- Publication number 20230335643
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20230260796
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Jen CHANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VIAS FOR COBALT-BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220375790
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE
- Publication number 20220277993
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE DIODE DESIGN
- Publication number 20220278161
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS
- Publication number 20220231066
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Cheng Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Fins With Different Dielectric Constants and Sizes in Di...
- Publication number 20220208615
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Plugs and Methods Forming Same
- Publication number 20210202713
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210143277
- Publication date May 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Structure with Controlled Air Gaps
- Publication number 20210118723
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A LINER LAYER W...
- Publication number 20200350205
- Publication date Nov 5, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric Fins With Different Dielectric Constants and Sizes in Di...
- Publication number 20200135580
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Min-Yann Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20200126855
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Co., LTD
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Isolation Structure and Method for Fabricating the Same
- Publication number 20200119007
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE
- Publication number 20200098625
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Resistor and Method of Making Same
- Publication number 20190280097
- Publication date Sep 12, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hua Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT SOURCE MODULE AND SURFACE LIGHT SOURCE ASSEMBLY THEREOF
- Publication number 20190227214
- Publication date Jul 25, 2019
- CORETRONIC CORPORATION
- HUA CHEN
- G02 - OPTICS
Information Patent Application
Contact Plugs and Methods Forming Same
- Publication number 20190103473
- Publication date Apr 4, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFET Structure with Controlled Air Gaps
- Publication number 20190096740
- Publication date Mar 28, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20190067276
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Che Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof
- Publication number 20190067093
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE...
- Publication number 20190006235
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Joanna Chaw Yane YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTACT MEASUREMENT DEVICE FOR RADIUS OF CURVATURE AND THICKNES...
- Publication number 20180356311
- Publication date Dec 13, 2018
- NATIONAL APPLIED RESEARCH LABORATORIES
- WEI-YAO HSU
- G01 - MEASURING TESTING

Hua-Sheng Chen

Person

Patents Grantslast 30 patents

Vias for cobalt-based interconnects and methods of fabrication thereof

Trench isolation structure for image sensors

Contact plugs and methods forming same

Contact structure of a semiconductor device

FinFET structure with controlled air gaps

Semiconductor device and manufacturing method thereof

Method of fabricating a semiconductor device having a liner layer w...

Vias for cobalt-based interconnects and methods of fabrication thereof

Dielectric fins with different dielectric constants and sizes in di...

FinFET isolation structure and method for fabricating the same

Semiconductor device having a liner layer with a configured profile

Contact plugs and methods forming same

FinFET structure with controlled air gaps

Substrate resistor and method of making same

Semiconductor device and manufacturing method thereof

Source and drain dislocation fabrication in FinFETs

Method for integrated circuit patterning

Semiconductor device having a liner layer with a configured profile...

Light source module and surface light source assembly thereof

Vias for cobalt-based interconnects and methods of fabrication thereof

Contact plugs and methods forming same

FinFET isolation structure and method for fabricating the same

Fault isolation system and method for detecting faults in a circuit

Surface light source assembly having light guide with groove struct...

Method for manufacturing a semiconductor device

Sidewall spacers for self-aligned contacts

Substrate resistor and method of making same

Non-contact measurement device for radius of curvature and thicknes...

FinFET structure with controlled air gaps

Method for integrated circuit patterning

Patents Applicationslast 30 patents

Dielectric Fins With Different Dielectric Constants and Sizes in Di...

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

SEMICONDUCTOR DEVICE

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

CONTACT PLUGS AND METHODS FORMING SAME

TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS

FINFET STRUCTURE WITH CONTROLLED AIR GAPS

SEMICONDUCTOR DEVICE WITH SOURCE/DRAIN CONTACT

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

VIAS FOR COBALT-BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

CONTACT STRUCTURE OF A SEMICONDUCTOR DEVICE

BACKSIDE DIODE DESIGN

TRENCH ISOLATION STRUCTURE FOR IMAGE SENSORS

Dielectric Fins With Different Dielectric Constants and Sizes in Di...

Contact Plugs and Methods Forming Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

FinFET Structure with Controlled Air Gaps

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING A LINER LAYER W...

Dielectric Fins With Different Dielectric Constants and Sizes in Di...

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

FinFET Isolation Structure and Method for Fabricating the Same

SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE

Substrate Resistor and Method of Making Same

LIGHT SOURCE MODULE AND SURFACE LIGHT SOURCE ASSEMBLY THEREOF

Contact Plugs and Methods Forming Same

FinFET Structure with Controlled Air Gaps

FINFET ISOLATION STRUCTURE AND METHOD FOR FABRICATING THE SAME

Vias for Cobalt-Based Interconnects and Methods of Fabrication Thereof

SEMICONDUCTOR DEVICE HAVING A LINER LAYER WITH A CONFIGURED PROFILE...

NON-CONTACT MEASUREMENT DEVICE FOR RADIUS OF CURVATURE AND THICKNES...