Hua-Tal Lin

Person

Yuang-Kang City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 12,362,180
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Feature patterning using pitch relaxation and directional end-pushi...
- Patent number 12,315,737
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hua Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual critical dimension patterning
- Patent number 12,308,233
- Issue date May 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chang Kau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,210,200
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having prism structure and manufacturing method thereof
- Patent number 12,164,158
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Grant
Memory device and manufacturing method thereof
- Patent number 12,120,886
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Pei-Sheng Tang
Information Patent Grant
Semiconductor package
- Patent number 12,105,323
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 11,996,297
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices
- Patent number 11,961,738
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Ta Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,953,740
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,947,173
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
EUV photomask
- Patent number 11,846,881
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Huang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic integrated circuit and package structure
- Patent number 11,809,000
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film non-uniform stress evaluation
- Patent number 11,804,410
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-De Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical interconnect structure, package structure and fabricating m...
- Patent number 11,768,338
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Ethernet power supply device
- Patent number 11,764,982
- Issue date Sep 19, 2023
- Wistron NeWeb Corp.
- Hua Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,754,780
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Method and apparatus for integrated circuit mask patterning
- Patent number 11,748,549
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Min Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etch monitoring and performing
- Patent number 11,749,570
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-De Ho
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,686,908
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Feature patterning using pitch relaxation and directional end-pushi...
- Patent number 11,688,610
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzung-Hua Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,640,935
- Issue date May 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 11,614,592
- Issue date Mar 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tunable illuminator for lithography systems
- Patent number 11,543,753
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ken-Hsien Hsieh
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
EUV mask
- Patent number 11,448,956
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ching-Huang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for improving circuit layout for manufacturability
- Patent number 11,392,745
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun-Lin Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing semiconductor device and system for perfor...
- Patent number 11,392,045
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Yun Wang
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Magnetic component module
- Patent number 11,120,936
- Issue date Sep 14, 2021
- Delta Electronics, Inc.
- Hsin-Wei Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for integrated circuit mask patterning
- Patent number 10,990,744
- Issue date Apr 27, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Min Huang
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20250123458
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20250125224
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250070013
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE
- Publication number 20250060542
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240389353
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Sheng TANG
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240369759
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES
- Publication number 20240234143
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Ta CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240210636
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20240192456
- Publication date Jun 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR DEVICE
- Publication number 20240105518
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Ta CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH MONITORING AND PERFORMING
- Publication number 20240030073
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE
- Publication number 20240012213
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Yuan Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402277
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Ta CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230367062
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
FEATURE PATTERNING USING PITCH RELAXATION AND DIRECTIONAL END-PUSHI...
- Publication number 20230298901
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzung-Hua LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photonic Semiconductor Device and Method of Manufacture
- Publication number 20230280558
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20230245967
- Publication date Aug 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture
- Publication number 20230236372
- Publication date Jul 27, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230152542
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR...
- Publication number 20230139799
- Publication date May 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ETCH MONITORING AND PERFORMING
- Publication number 20230062426
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230067049
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pei-Sheng TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE HAVING PRISM STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230066363
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Hsiang Hsu
- G02 - OPTICS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20230049896
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Dah CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230018511
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING M...
- Publication number 20220382004
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
EUV PHOTOMASK
- Publication number 20220373876
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Huang CHEN
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220365273
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20220365297
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM NON-UNIFORM STRESS EVALUATION
- Publication number 20220359313
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-De HO
- H01 - BASIC ELECTRIC ELEMENTS

Hua-Tal Lin

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor devices

Feature patterning using pitch relaxation and directional end-pushi...

Dual critical dimension patterning

Photonic semiconductor device and method of manufacture

Manufacturing method of semiconductor package

Package having prism structure and manufacturing method thereof

Memory device and manufacturing method thereof

Semiconductor package

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor devices

Package structure

Photonic semiconductor device and method of manufacture

EUV photomask

Photonic integrated circuit and package structure

Thin-film non-uniform stress evaluation

Optical interconnect structure, package structure and fabricating m...

Ethernet power supply device

Semiconductor package and manufacturing method thereof

Method and apparatus for integrated circuit mask patterning

Etch monitoring and performing

Photonic semiconductor device and method of manufacture

Feature patterning using pitch relaxation and directional end-pushi...

Semiconductor package and manufacturing method thereof

Semiconductor devices and methods of manufacture

Tunable illuminator for lithography systems

EUV mask

Method for improving circuit layout for manufacturability

Method for manufacturing semiconductor device and system for perfor...

Magnetic component module

Method and apparatus for integrated circuit mask patterning

Patents Applicationslast 30 patents

Photonic Semiconductor Device and Method of Manufacture

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE

PACKAGE HAVING PRISM STRUCTURE

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES

PACKAGE STRUCTURE

Photonic Semiconductor Device and Method of Manufacture

METHOD FOR FORMING SEMICONDUCTOR DEVICE

ETCH MONITORING AND PERFORMING

PHOTONIC INTEGRATED CIRCUIT AND PACKAGE STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

FEATURE PATTERNING USING PITCH RELAXATION AND DIRECTIONAL END-PUSHI...

Photonic Semiconductor Device and Method of Manufacture

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Semiconductor Devices and Methods of Manufacture

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF SEMICONDUCTOR...

ETCH MONITORING AND PERFORMING

MEMORY DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE HAVING PRISM STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

OPTICAL INTERCONNECT STRUCTURE, PACKAGE STRUCTURE AND FABRICATING M...

EUV PHOTOMASK

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

THIN-FILM NON-UNIFORM STRESS EVALUATION