Hua-Wen Chiang

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Power consumption monitoring device and method
- Patent number 12,153,506
- Issue date Nov 26, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Wei-Chao Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System and method for drone docking
- Patent number 11,906,982
- Issue date Feb 20, 2024
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Unmanned aerial vehicle control system and unmanned aerial vehicle...
- Patent number 11,874,657
- Issue date Jan 16, 2024
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- G08 - SIGNALLING
Information Patent Grant
User equipment and buffer status report cancellation method based o...
- Patent number 11,617,102
- Issue date Mar 28, 2023
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Management apparatus and management method thereof for electronic e...
- Patent number 11,410,133
- Issue date Aug 9, 2022
- Far EasTone Telecommunications Co., Ltd.
- Herman Chunghwa Rao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chip package with cooling arrangement
- Patent number 6,567,270
- Issue date May 20, 2003
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for making a metal bump with an increased height
- Patent number 6,499,648
- Issue date Dec 31, 2002
- Orient Semiconductor Electronics Limited
- Wen-Lo Shieh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming cylindrical bumps on a substrate for integrated c...
- Patent number 6,390,356
- Issue date May 21, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming bumps on wafers or substrates
- Patent number 6,358,834
- Issue date Mar 19, 2002
- Orient Semiconductor Electronics Limited
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing thin ball grid array substrates
- Patent number 6,274,491
- Issue date Aug 14, 2001
- Orient Semiconductor Electronics Limited
- Wan Le Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...
- Publication number 20240250719
- Publication date Jul 25, 2024
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- LI-HSIANG SHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWER CONSUMPTION MONITORING DEVICE AND METHOD
- Publication number 20240087057
- Publication date Mar 14, 2024
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Wei-Chao CHEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD OF USING BASE STATION ALGORITHM TO PLAN EMERGENT...
- Publication number 20230245556
- Publication date Aug 3, 2023
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- CHUNG HWA RAO
- G08 - SIGNALLING
Information Patent Application
UNMANNED AERIAL VEHICLE CONTROL SYSTEM AND UNMANNED AERIAL VEHICLE...
- Publication number 20220066445
- Publication date Mar 3, 2022
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Herman Chunghwa Rao
- G08 - SIGNALLING
Information Patent Application
USER EQUIPMENT AND BUFFER STATUS REPORT CANCELLATION METHOD BASED O...
- Publication number 20210368382
- Publication date Nov 25, 2021
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Herman Chunghwa Rao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SYSTEM AND METHOD FOR DRONE DOCKING
- Publication number 20210365047
- Publication date Nov 25, 2021
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Herman Chunghwa Rao
- G05 - CONTROLLING REGULATING
Information Patent Application
MANAGEMENT APPARATUS AND MANAGEMENT METHOD THEREOF FOR ELECTRONIC E...
- Publication number 20200210970
- Publication date Jul 2, 2020
- FAR EASTONE TELECOMMUNICATIONS CO., LTD.
- Herman Chunghwa Rao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fabrication method of semiconductor
- Publication number 20030059721
- Publication date Mar 27, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package with cooling arrangement
- Publication number 20030035270
- Publication date Feb 20, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for making a metal bump with an increased height
- Publication number 20030006268
- Publication date Jan 9, 2003
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT
- Publication number 20020179686
- Publication date Dec 5, 2002
- Wen-Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for multilayer high density substrate
- Publication number 20020072216
- Publication date Jun 13, 2002
- Wen Lo Shieh
- H01 - BASIC ELECTRIC ELEMENTS

Hua-Wen Chiang

Person

Patents Grantslast 30 patents

Power consumption monitoring device and method

System and method for drone docking

Unmanned aerial vehicle control system and unmanned aerial vehicle...

User equipment and buffer status report cancellation method based o...

Management apparatus and management method thereof for electronic e...

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

Method of forming cylindrical bumps on a substrate for integrated c...

Method of forming bumps on wafers or substrates

Process of manufacturing thin ball grid array substrates

Patents Applicationslast 30 patents

AUTOMATIC SIGNAL DEPLOYER, SIGNAL DEPLOYMENT SYSTEM, AUTOMATIC SIGN...

POWER CONSUMPTION MONITORING DEVICE AND METHOD

SYSTEM AND METHOD OF USING BASE STATION ALGORITHM TO PLAN EMERGENT...

UNMANNED AERIAL VEHICLE CONTROL SYSTEM AND UNMANNED AERIAL VEHICLE...

USER EQUIPMENT AND BUFFER STATUS REPORT CANCELLATION METHOD BASED O...

SYSTEM AND METHOD FOR DRONE DOCKING

MANAGEMENT APPARATUS AND MANAGEMENT METHOD THEREOF FOR ELECTRONIC E...

Fabrication method of semiconductor

Semiconductor chip package with cooling arrangement

Method and device for making a metal bump with an increased height

METHOD AND DEVICE FOR MAKING A METAL BUMP WITH AN INCREASED HEIGHT

Manufacturing method for multilayer high density substrate