Hua Younan

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Method to prevent corrosion of bond pad structure
- Patent number 8,207,052
- Issue date Jun 26, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Younan Hua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for performing a shelf lifetime acceleration test
- Patent number 8,061,224
- Issue date Nov 22, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Siping Zhao
- G01 - MEASURING TESTING
Information Patent Grant
Method for etching a silicided poly using fluorine-based reactive i...
- Patent number 6,689,698
- Issue date Feb 10, 2004
- Chartered Semiconductor Manufacturing Limited
- Song Zhigang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO PREVENT CORROSION OF BOND PAD STRUCTURE
- Publication number 20100184285
- Publication date Jul 22, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Younan HUA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PERFORMING A SHELF LIFETIME ACCELERATION TEST
- Publication number 20090277287
- Publication date Nov 12, 2009
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Siping ZHAO
- G01 - MEASURING TESTING
Information Patent Application
Method for etching a silicided poly using fluorine-based reactive i...
- Publication number 20030092276
- Publication date May 15, 2003
- CHARTERED SEMICONDUCTORS MANUFACTURED LIMITED
- Song Zhigang
- H01 - BASIC ELECTRIC ELEMENTS