Huailiang Wei

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Allen, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Low cost hybrid high density package
- Patent number 9,875,955
- Issue date Jan 23, 2018
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost hybrid high density package
- Patent number 9,508,687
- Issue date Nov 29, 2016
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,349,669
- Issue date May 24, 2016
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 9,000,600
- Issue date Apr 7, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost hybrid high density package
- Patent number 8,963,310
- Issue date Feb 24, 2015
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced stress TSV and interposer structures
- Patent number 8,772,946
- Issue date Jul 8, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Area array quad flat no-lead (QFN) package
- Patent number 8,525,312
- Issue date Sep 3, 2013
- Tessera, Inc.
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Low cost hybrid high density package
- Publication number 20170077018
- Publication date Mar 16, 2017
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20150187673
- Publication date Jul 2, 2015
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HYBRID HIGH DENSITY PACKAGE
- Publication number 20150171058
- Publication date Jun 18, 2015
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20140217607
- Publication date Aug 7, 2014
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED STRESS TSV AND INTERPOSER STRUCTURES
- Publication number 20130328186
- Publication date Dec 12, 2013
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HYBRID HIGH DENSITY PACKAGE
- Publication number 20130049179
- Publication date Feb 28, 2013
- Tessera, Inc.
- Kishor Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AREA ARRAY QFN
- Publication number 20130037925
- Publication date Feb 14, 2013
- Tessera, Inc.
- Qwai H. Low
- H01 - BASIC ELECTRIC ELEMENTS