Hualiang Shi

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Structures to mitigate contamination on a back side of a semiconduc...
- Patent number 9,698,108
- Issue date Jul 4, 2017
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution to deal with die warpage during 3D die-to-die stacking
- Patent number 8,970,051
- Issue date Mar 3, 2015
- Intel Corporation
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES TO MITIGATE CONTAMINATION ON A BACK SIDE OF A SEMICONDUC...
- Publication number 20170186707
- Publication date Jun 29, 2017
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS
- Publication number 20150001736
- Publication date Jan 1, 2015
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLUTION TO DEAL WITH DIE WARPAGE DURING 3D DIE-TO-DIE STACKING
- Publication number 20150001740
- Publication date Jan 1, 2015
- Hualiang SHI
- H01 - BASIC ELECTRIC ELEMENTS