Huan-Ling Lee

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Taoyuan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Carrier and method for fabricating coreless packaging substrate
- Patent number 9,485,863
- Issue date Nov 1, 2016
- Unimicron Technology Corp.
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CARRIER AND METHOD FOR FABRICATING CORELESS PACKAGING SUBSTRATE
- Publication number 20130335928
- Publication date Dec 19, 2013
- Unimicron Technology Corporation
- Tzyy-Jang Tseng
- H01 - BASIC ELECTRIC ELEMENTS