Huan-Ping Su

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure with wraparound backside amorphous layer
- Patent number 12,148,805
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increasing device density and reducing cross-talk spacer structures
- Patent number 12,148,795
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with isolation structure
- Patent number 12,142,692
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside vias in semiconductor device
- Patent number 12,132,092
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate transistors with backside power rail and reduced gate-dr...
- Patent number 12,125,852
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device
- Patent number 12,107,011
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned air spacers and methods for forming
- Patent number 12,107,146
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and methods of fabri...
- Patent number 12,094,973
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate cut structure and method of forming...
- Patent number 12,057,341
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with gate cut feature and method for forming t...
- Patent number 12,046,516
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method (and related apparatus) for forming a semiconductor device w...
- Patent number 12,034,004
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate isolation feature and manufacturing method thereof
- Patent number 12,021,136
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain contacts and methods of forming same
- Patent number 12,009,394
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside gate contact
- Patent number 11,996,461
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner for a bi-layer gate helmet and the fabrication thereof
- Patent number 11,996,481
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with backside interconnection structur...
- Patent number 11,984,350
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET devices and methods of forming the same
- Patent number 11,978,802
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation method of semiconductor device structure with semiconduct...
- Patent number 11,978,773
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside power rail and methods of fabric...
- Patent number 11,955,552
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side contact structures in semiconductor devices
- Patent number 11,955,515
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around field-effect transistor device
- Patent number 11,948,973
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and methods of fabri...
- Patent number 11,942,530
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming long channel back-side power rail device
- Patent number 11,935,794
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with metal gate stack
- Patent number 11,929,413
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jia-Chuan You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with backside power rail and method thereof
- Patent number 11,923,408
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming spacers for semiconductor devices including back...
- Patent number 11,915,972
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitance reduction for backside power rail device
- Patent number 11,901,423
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with backside gate isolation structure and met...
- Patent number 11,901,428
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-gate device and related methods
- Patent number 11,854,908
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with FinFET gate structures
- Patent number 11,855,082
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuo-Cheng Ching
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER
- Publication number 20250006807
- Publication date Jan 2, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chuan Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES
- Publication number 20240429292
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT
- Publication number 20240395938
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Thereof
- Publication number 20240387664
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...
- Publication number 20240387732
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Spacers for Semiconductor Devices Including Backside Power Rails
- Publication number 20240387249
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CONTACT STRUCTURE
- Publication number 20240387261
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME
- Publication number 20240387534
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRAIN SIDE RECESS FOR BACK-SIDE POWER RAIL DEVICE
- Publication number 20240379783
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES
- Publication number 20240379745
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS
- Publication number 20240379775
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Huan Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INCLUDING DUAL-SIDE POWER AND INNER WRAP-AROUND SILICIDE
- Publication number 20240371971
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Backside Vias in Semiconductor Device
- Publication number 20240371957
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240363684
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING...
- Publication number 20240363396
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED AIR SPACERS
- Publication number 20240363727
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD (AND RELATED APPARATUS) FOR FORMING A SEMICONDUCTOR DEVICE W...
- Publication number 20240355818
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zhi-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING T...
- Publication number 20240347389
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONTACT STRUCTURES AND METHODS
- Publication number 20240339524
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate Isolation Feature and Manufacturing Method Thereof
- Publication number 20240339526
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Co., LTD
- Kuan-Ting Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF
- Publication number 20240322041
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FO...
- Publication number 20240313065
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE GATE CONTACT
- Publication number 20240304695
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METH...
- Publication number 20240290850
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yun Ju Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE CONTACT
- Publication number 20240290851
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Contacts and Methods of Forming Same
- Publication number 20240290852
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WRAP-AROUND SILICIDE LAYER
- Publication number 20240290849
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Huan Jao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING LONG CHANNEL BACK-SIDE POWER RAIL DEVICE
- Publication number 20240266223
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huan-Chieh Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTUR...
- Publication number 20240258158
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Zhen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...
- Publication number 20240258397
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Huan-Ping Su

Person

Patents Grantslast 30 patents

Semiconductor structure with wraparound backside amorphous layer

Increasing device density and reducing cross-talk spacer structures

Semiconductor device with isolation structure

Backside vias in semiconductor device

Multi-gate transistors with backside power rail and reduced gate-dr...

Method for fabricating a semiconductor device

Self-aligned air spacers and methods for forming

Semiconductor devices with backside power rail and methods of fabri...

Semiconductor device with gate cut structure and method of forming...

Semiconductor device with gate cut feature and method for forming t...

Method (and related apparatus) for forming a semiconductor device w...

Gate isolation feature and manufacturing method thereof

Source/drain contacts and methods of forming same

Backside gate contact

Liner for a bi-layer gate helmet and the fabrication thereof

Integrated circuit structure with backside interconnection structur...

FinFET devices and methods of forming the same

Formation method of semiconductor device structure with semiconduct...

Semiconductor device with backside power rail and methods of fabric...

Dual side contact structures in semiconductor devices

Gate-all-around field-effect transistor device

Semiconductor devices with backside power rail and methods of fabri...

Method for forming long channel back-side power rail device

Semiconductor device structure with metal gate stack

Semiconductor devices with backside power rail and method thereof

Methods of forming spacers for semiconductor devices including back...

Capacitance reduction for backside power rail device

Semiconductor device with backside gate isolation structure and met...

Multi-gate device and related methods

Integrated circuits with FinFET gate structures

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE WITH WRAPAROUND BACKSIDE AMORPHOUS LAYER

SEMICONDUCTOR DEVICE ISOLATION OF CONTACT AND SOURCE/DRAIN STRUCTURES

BACKSIDE CONTACT

Semiconductor Device and Method of Forming Thereof

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...

Spacers for Semiconductor Devices Including Backside Power Rails

GATE CONTACT STRUCTURE

BACKSIDE POWER RAIL AND METHODS OF FORMING THE SAME

DRAIN SIDE RECESS FOR BACK-SIDE POWER RAIL DEVICE

INCREASING DEVICE DENSITY AND REDUCING CROSS-TALK SPACER STRUCTURES

PROCESS AND STRUCTURE FOR SOURCE/DRAIN CONTACTS

TRANSISTOR INCLUDING DUAL-SIDE POWER AND INNER WRAP-AROUND SILICIDE

Backside Vias in Semiconductor Device

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE WITH GATE CUT STRUCTURE AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED AIR SPACERS

METHOD (AND RELATED APPARATUS) FOR FORMING A SEMICONDUCTOR DEVICE W...

SEMICONDUCTOR DEVICE WITH GATE CUT FEATURE AND METHOD FOR FORMING T...

SEMICONDUCTOR CONTACT STRUCTURES AND METHODS

Gate Isolation Feature and Manufacturing Method Thereof

LINER FOR A BI-LAYER GATE HELMET AND THE FABRICATION THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH CONTACT STRUCTURE AND METHOD FO...

BACKSIDE GATE CONTACT

SEMICONDUCTOR STRUCTURE WITH BACKSIDE SELF-ALIGNED CONTACT AND METH...

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE CONTACT

Source/Drain Contacts and Methods of Forming Same

WRAP-AROUND SILICIDE LAYER

METHOD FOR FORMING LONG CHANNEL BACK-SIDE POWER RAIL DEVICE

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE INTERCONNECTION STRUCTUR...

SEMICONDUCTOR DEVICES WITH BACKSIDE POWER RAIL AND METHODS OF FABRI...