Huan Wang

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assembled using two lead frames
- Patent number 9,209,119
- Issue date Dec 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of assembling same
- Patent number 9,129,948
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Helix substrate and three-dimensional package with same
- Patent number 8,907,464
- Issue date Dec 9, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Huan Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of assembling same
- Patent number 8,878,348
- Issue date Nov 4, 2014
- Freescale Semicondustor, Inc.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLED USING TWO LEAD FRAMES
- Publication number 20150357266
- Publication date Dec 10, 2015
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20150011053
- Publication date Jan 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME
- Publication number 20140284805
- Publication date Sep 25, 2014
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HELIX SUBSTRATE AND THREE-DIMENSIONAL PACKAGE WITH SAME
- Publication number 20140146497
- Publication date May 29, 2014
- Huan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME
- Publication number 20140070388
- Publication date Mar 13, 2014
- Meiquan Huang
- H01 - BASIC ELECTRIC ELEMENTS