Huanfeng Zhu

Person

West Linn, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper electroplating process for uniform across wafer deposition a...
- Patent number 8,703,615
- Issue date Apr 22, 2014
- Novellus Systems, Inc.
- Thomas A. Ponnuswamy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for filling interconnect structures
- Patent number 8,575,028
- Issue date Nov 5, 2013
- Novellus Systems, Inc.
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...
- Publication number 20220208604
- Publication date Jun 30, 2022
- LAM RESEARCH CORPORATION
- Huanfeng Zhu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BOTTOM-UP FILL IN DAMASCENE FEATURES
- Publication number 20150053565
- Publication date Feb 26, 2015
- LAM RESEARCH CORPORATION
- Huanfeng Zhu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES
- Publication number 20140199497
- Publication date Jul 17, 2014
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES
- Publication number 20140124361
- Publication date May 8, 2014
- LAM RESEARCH CORPORATION
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES
- Publication number 20120261254
- Publication date Oct 18, 2012
- Jonathan D. REID
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES
- Publication number 20120264290
- Publication date Oct 18, 2012
- Jonathan D. REID
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Huanfeng Zhu

Person

Patents Grantslast 30 patents

Copper electroplating process for uniform across wafer deposition a...

Method and apparatus for filling interconnect structures

Patents Applicationslast 30 patents

PROTECTION OF SEED LAYERS DURING ELECTRODEPOSITION OF METALS IN SEM...

BOTTOM-UP FILL IN DAMASCENE FEATURES

METHODS FOR REDUCING METAL OXIDE SURFACES TO MODIFIED METAL SURFACES

METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES

METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES

METHOD AND APPARATUS FOR FILLING INTERCONNECT STRUCTURES