Huang-Cheng Ke

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Taipei City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic device with phase change material microcapsule layer
- Patent number 9,282,679
- Issue date Mar 8, 2016
- INVENTEC (PUDONG) TECHNOLOGY CORPORATION
- Huang-Cheng Ke
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipation module
- Patent number 7,954,541
- Issue date Jun 7, 2011
- Inventec Corporation
- Feng-Ku Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink module for dual heat sources
- Patent number 7,405,937
- Issue date Jul 29, 2008
- Inventec Corporation
- Feng-Ku Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE
- Publication number 20150156915
- Publication date Jun 4, 2015
- Inventec Corporation
- Huang-Cheng KE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20090056925
- Publication date Mar 5, 2009
- Inventec Corporation
- Feng-Ku Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK MODULE FOR DUAL HEAT SOURCES
- Publication number 20080198550
- Publication date Aug 21, 2008
- Inventec Corporation
- Feng-Ku Wang
- H01 - BASIC ELECTRIC ELEMENTS