Huang-choung Chang

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
FinFET devices having gate stacks with protruding parts and method...
- Patent number 11,056,392
- Issue date Jul 6, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimple-free tungsten plug
- Patent number 5,672,914
- Issue date Sep 30, 1997
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dimple-free tungsten etching back process
- Patent number 5,527,736
- Issue date Jun 18, 1996
- Taiwan Semiconductor Manufacturing Co.
- Yuan-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE WITH HIGH INTEGRATION DENSITY AND METHOD FO...
- Publication number 20240088149
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gates of Hybrid-Fin Devices
- Publication number 20230335644
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Juei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICES AND METHOD OF FORMING THE SAME
- Publication number 20190304842
- Publication date Oct 3, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chien Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSED BY THIS METHOD
- Publication number 20100310828
- Publication date Dec 9, 2010
- Ulvac, Inc.
- Susumu Sakio
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...