Huang-Chuan Chang

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Taichung Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Process for forming lead-free bump on electronic component
- Patent number 7,341,949
- Issue date Mar 11, 2008
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process for forming lead-free bump on electronic component
- Publication number 20050042872
- Publication date Feb 24, 2005
- Siliconware Precision Industries Co., Ltd., Taiwan, R.O.C.
- Feng-Lung Chien
- H01 - BASIC ELECTRIC ELEMENTS