Huang Shuang Wu

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 8,008,126
- Issue date Aug 30, 2011
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,679,179
- Issue date Mar 16, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,528,477
- Issue date May 5, 2009
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 7,276,387
- Issue date Oct 2, 2007
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,949,407
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Castellation wafer level packaging of integrated circuit chips
- Patent number 6,855,572
- Issue date Feb 15, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20100068851
- Publication date Mar 18, 2010
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20080067675
- Publication date Mar 20, 2008
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060014319
- Publication date Jan 19, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060008946
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060006519
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001142
- Publication date Jan 5, 2006
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS
- Publication number 20050130345
- Publication date Jun 16, 2005
- Micron Technology, Inc.
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20040043535
- Publication date Mar 4, 2004
- Boon Suan Jeung
- H01 - BASIC ELECTRIC ELEMENTS

Huang Shuang Wu

Person

Patents Grantslast 30 patents

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Patents Applicationslast 30 patents

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

CASTELLATION WAFER LEVEL PACKAGING OF INTEGRATED CIRCUIT CHIPS

Castellation wafer level packaging of integrated circuit chips