Huang-Wen Tseng

Person

Zhubei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Inductive device
- Patent number 11,908,884
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting defects in semiconductor device
- Patent number 11,854,913
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,837,526
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for forming the same
- Patent number 11,804,433
- Issue date Oct 31, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,776,919
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 11,721,597
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory
- Patent number 11,672,181
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Huang-Wen Tseng
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with enhanced thermal dissipation and method f...
- Patent number 11,626,343
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for making the same
- Patent number 11,482,461
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,450,626
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for single gate non-volatile memory device
- Patent number 11,417,670
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Felix Ying-Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device
- Patent number 11,322,576
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual micro-electro mechanical system and manufacturing method thereof
- Patent number 11,274,037
- Issue date Mar 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device having probe pads and seal ring
- Patent number 11,088,037
- Issue date Aug 10, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory with various size magnetic tunneling...
- Patent number 11,038,098
- Issue date Jun 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Wen Tseng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method for manufacturing semiconductor and structure thereof
- Patent number 10,937,858
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,937,772
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic random access memory with various size magnetic tunneling...
- Patent number 10,784,440
- Issue date Sep 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Huang-Wen Tseng
- G11 - INFORMATION STORAGE
Information Patent Grant
Method of detecting delamination in an integrated circuit package s...
- Patent number 10,699,977
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor and structure thereof
- Patent number 10,629,673
- Issue date Apr 21, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package structure and testing method using the same
- Patent number 10,347,548
- Issue date Jul 9, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for single gate non-volatile memory device
- Patent number 10,153,290
- Issue date Dec 11, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Felix Ying-Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photoelectrical coversion module
- Patent number 9,525,079
- Issue date Dec 20, 2016
- AU OPTRONICS CORPORATION
- Yung-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solar cell and solar cell module
- Patent number 9,224,887
- Issue date Dec 29, 2015
- AU Optronics Corp.
- Chun-Ming Yang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Heat dissipation structure
- Patent number 9,171,983
- Issue date Oct 27, 2015
- AU OPTRONICS CORPORATION
- Huang-Chi Tseng
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Bridging solar cell and solar energy system
- Patent number 8,829,338
- Issue date Sep 9, 2014
- AU OPTRONICS CORPORATION
- Huang-Chi Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photovoltaic array system, photovoltaic device thereof, and frame e...
- Patent number 8,806,814
- Issue date Aug 19, 2014
- AU OPTRONICS CORPORATION
- Huang-Chi Tseng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Corner key and frame assembly
- Patent number 8,763,342
- Issue date Jul 1, 2014
- AU Optronics Corp.
- Huang-Chi Tseng
- E06 - DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL LADDERS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240047310
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20230387182
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230064152
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220406705
- Publication date Dec 22, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20220384281
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220375881
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20220376034
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20220367318
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Single Gate Non-Volatile Memory Device
- Publication number 20220367494
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Felix Ying-Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20220231116
- Publication date Jul 21, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20220194783
- Publication date Jun 23, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068845
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE DEVICE
- Publication number 20220037458
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Yu CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE
- Publication number 20210366794
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20210313510
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Huang-Wen TSENG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20210202329
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF
- Publication number 20210130167
- Publication date May 6, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20210013399
- Publication date Jan 14, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Wen TSENG
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402892
- Publication date Dec 24, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200381409
- Publication date Dec 3, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF
- Publication number 20200251552
- Publication date Aug 6, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...
- Publication number 20200135613
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF
- Publication number 20200098851
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20200075435
- Publication date Mar 5, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- YANG-CHE CHEN
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...
- Publication number 20190333829
- Publication date Oct 31, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che CHEN
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC RANDOM ACCESS MEMORY
- Publication number 20190148625
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huang-Wen TSENG
- G11 - INFORMATION STORAGE
Information Patent Application
Structure and Method for Single Gate Non-Volatile Memory Device
- Publication number 20190088666
- Publication date Mar 21, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Felix Ying-Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME
- Publication number 20180156865
- Publication date Jun 7, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yang-Che Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR SINGLE GATE NON-VOLATILE MEMORY DEVICE
- Publication number 20160005751
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Felix Ying-Kit Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLAR CELL MODULE
- Publication number 20150144179
- Publication date May 28, 2015
- AU OPTRONICS CORPORATION
- Yung-Chih CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Huang-Wen Tseng

Person

Patents Grantslast 30 patents

Inductive device

Method for detecting defects in semiconductor device

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for forming the same

Semiconductor package

Semiconductor device and manufacturing method of the same

Magnetic random access memory

Semiconductor device with enhanced thermal dissipation and method f...

Semiconductor package and method for making the same

Semiconductor package

Structure and method for single gate non-volatile memory device

Inductive device

Dual micro-electro mechanical system and manufacturing method thereof

Semiconductor device having probe pads and seal ring

Magnetic random access memory with various size magnetic tunneling...

Method for manufacturing semiconductor and structure thereof

Semiconductor package and method for manufacturing the same

Magnetic random access memory with various size magnetic tunneling...

Method of detecting delamination in an integrated circuit package s...

Method for manufacturing semiconductor and structure thereof

Integrated circuit package structure and testing method using the same

Structure and method for single gate non-volatile memory device

Photoelectrical coversion module

Solar cell and solar cell module

Heat dissipation structure

Bridging solar cell and solar energy system

Photovoltaic array system, photovoltaic device thereof, and frame e...

Corner key and frame assembly

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INDUCTIVE DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

Structure and Method for Single Gate Non-Volatile Memory Device

INDUCTIVE DEVICE

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE

INDUCTIVE DEVICE

METHOD FOR DETECTING DEFECTS IN SEMICONDUCTOR DEVICE

MAGNETIC RANDOM ACCESS MEMORY

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF

MAGNETIC RANDOM ACCESS MEMORY

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF

SEMICONDUCTOR DEVICE WITH ENHANCED THERMAL DISSIPATION AND METHOD F...

METHOD FOR MANUFACTURING SEMICONDUCTOR AND STRUCTURE THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE S...

MAGNETIC RANDOM ACCESS MEMORY

Structure and Method for Single Gate Non-Volatile Memory Device

INTEGRATED CIRCUIT PACKAGE STRUCTURE AND TESTING METHOD USING THE SAME

STRUCTURE AND METHOD FOR SINGLE GATE NON-VOLATILE MEMORY DEVICE

SOLAR CELL MODULE