Huatan Qiu

Person

Dublin, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Plasma generator systems and methods of forming plasma
- Patent number 9,591,738
- Issue date Mar 7, 2017
- Novellus Systems, Inc.
- Huatan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas flow distribution receptacles, plasma generator systems, and me...
- Patent number 9,209,000
- Issue date Dec 8, 2015
- Novellus Systems, Inc.
- Huatan Qiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous plasma and RF bias to regulate damage in a substrate pro...
- Patent number 9,194,045
- Issue date Nov 24, 2015
- Novellus Systems, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
High density plasma etchback process for advanced metallization app...
- Patent number 8,431,033
- Issue date Apr 30, 2013
- Novellus Systems, Inc.
- Chunming Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ashing method
- Patent number 8,273,259
- Issue date Sep 25, 2012
- Novellus Systems, Inc.
- Huatan Qiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas flow distribution receptacles, plasma generator systems, and me...
- Patent number 8,110,068
- Issue date Feb 7, 2012
- Novellus Systems, Inc.
- Huatan Qiu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLASMA PROCESS ETCH-TO-DEPOSITION RATIO MODULATION VIA GROUND SURFA...
- Publication number 20140127912
- Publication date May 8, 2014
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTINUOUS PLASMA AND RF BIAS TO REGULATE DAMAGE IN A SUBSTRATE PRO...
- Publication number 20130260057
- Publication date Oct 3, 2013
- Novellus Systems, Inc.
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...
- Publication number 20120228125
- Publication date Sep 13, 2012
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH DENSITY PLASMA ETCHBACK PROCESS FOR ADVANCED METALLIZATION APP...
- Publication number 20120152896
- Publication date Jun 21, 2012
- Chunming Zhou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS FLOW DISTRIBUTION RECEPTACLES, PLASMA GENERATOR SYSTEMS, AND ME...
- Publication number 20120097331
- Publication date Apr 26, 2012
- Novellus Systems, Inc.
- Huatan QIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...
- Publication number 20120070589
- Publication date Mar 22, 2012
- Liqi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PLASMA GENERATOR SYSTEMS AND METHODS OF FORMING PLASMA
- Publication number 20090250334
- Publication date Oct 8, 2009
- Novellus Systems, Inc.
- Huatan Qiu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GAS FLOW DISTRIBUTION RECEPTACLES, PLASMA GENERATOR SYSTEMS, AND ME...
- Publication number 20090236313
- Publication date Sep 24, 2009
- Novellus Systems, Inc.
- Huatan QIU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Plasma generator systems and methods of forming plasma

Gas flow distribution receptacles, plasma generator systems, and me...

Continuous plasma and RF bias to regulate damage in a substrate pro...

High density plasma etchback process for advanced metallization app...

Ashing method

Gas flow distribution receptacles, plasma generator systems, and me...

Patents Applicationslast 30 patents

PLASMA PROCESS ETCH-TO-DEPOSITION RATIO MODULATION VIA GROUND SURFA...

CONTINUOUS PLASMA AND RF BIAS TO REGULATE DAMAGE IN A SUBSTRATE PRO...

CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...

HIGH DENSITY PLASMA ETCHBACK PROCESS FOR ADVANCED METALLIZATION APP...

GAS FLOW DISTRIBUTION RECEPTACLES, PLASMA GENERATOR SYSTEMS, AND ME...

CREATION OF MAGNETIC FIELD (VECTOR POTENTIAL) WELL FOR IMPROVED PLA...

PLASMA GENERATOR SYSTEMS AND METHODS OF FORMING PLASMA

GAS FLOW DISTRIBUTION RECEPTACLES, PLASMA GENERATOR SYSTEMS, AND ME...