TREA

Huay Yann Tay

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  • Melaka, MY
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER LEVEL PROCESS FOR SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20240404973
    • Publication date Dec 5, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • Mohamad Ashraf bin Mohd Arshad
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
    • Publication number 20240339382
    • Publication date Oct 10, 2024
    • TEXAS INSTRUMENTS INCORPORATED
    • YOU CHYE HOW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-DIE INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING...
    • Publication number 20190206772
    • Publication date Jul 4, 2019
    • TEXAS INSTRUMENTS INCORPORATED
    • You Chye How
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE
    • Publication number 20170053883
    • Publication date Feb 23, 2017
    • TEXAS INSTRUMENTS INCORPORATED
    • You Chye How
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED CIRCUIT PACKAGE
    • Publication number 20150262920
    • Publication date Sep 17, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • You Chye How
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED PASSIVE FLIP CHIP PACKAGE
    • Publication number 20150243639
    • Publication date Aug 27, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • You Chye How
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CARRIER TAPE
    • Publication number 20150053586
    • Publication date Feb 26, 2015
    • TEXAS INSTRUMENTS INCORPORATED
    • You Chye How
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL