Hubert Allen Vander Plas

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Solder on a sloped surface
- Patent number 6,979,906
- Issue date Dec 27, 2005
- Hewlett-Packard Development Company, L.P.
- Hubert Allen Vander Plas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder on a sloped surface
- Patent number 6,764,937
- Issue date Jul 20, 2004
- Hewlett-Packard Development Company, L.P.
- Hubert Allen Vander Plas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple redundant through hole electrical interconnects and method...
- Patent number 6,659,592
- Issue date Dec 9, 2003
- Hewlett-Packard Development Company, L.P.
- Hubert Allen Vander Plas
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Planar multilayer ceramic structures with near surface channels
- Patent number 6,242,075
- Issue date Jun 5, 2001
- Hewlett-Packard Company
- Clinton C. Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder retention ring for improved solder bump formation
- Patent number 6,085,968
- Issue date Jul 11, 2000
- Hewlett-Packard Company
- Susan J. Swindlehurst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of bumping substrates by contained paste deposition
- Patent number 5,880,017
- Issue date Mar 9, 1999
- Hewlett-Packard Co.
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder balls by contained paste deposition
- Patent number 5,672,542
- Issue date Sep 30, 1997
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making solder balls by contained paste deposition
- Patent number 5,586,715
- Issue date Dec 24, 1996
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bumping substrates by contained paste deposition
- Patent number 5,539,153
- Issue date Jul 23, 1996
- Hewlett-Packard Company
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multiple redundant through hole electrical interconnects and method...
- Publication number 20030035027
- Publication date Feb 20, 2003
- Hubert Allen Vander Plas
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Hubert Allen Vander Plas

Person

Patents Grantslast 30 patents

Solder on a sloped surface

Solder on a sloped surface

Multiple redundant through hole electrical interconnects and method...

Planar multilayer ceramic structures with near surface channels

Solder retention ring for improved solder bump formation

Method of bumping substrates by contained paste deposition

Method of making solder balls by contained paste deposition

Method of making solder balls by contained paste deposition

Method of bumping substrates by contained paste deposition

Patents Applicationslast 30 patents

Multiple redundant through hole electrical interconnects and method...