Hubert Hinzen

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Eckental, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method and arrangement for subdividing semiconductor bars into semi...
- Patent number 5,285,597
- Issue date Feb 15, 1994
- GMN Georg Muller Nurnberg AG
- Hubert Hinzen
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for manufacturing semiconductor wafers and cut...
- Patent number 4,967,725
- Issue date Nov 6, 1990
- GMN Georg Muller Nurnberg AG
- Hubert Hinzen
- B28 - WORKING CEMENT, CLAY, OR STONE