Hubert Maier

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Passivation layer and method of making a passivation layer
- Patent number 9,728,480
- Issue date Aug 8, 2017
- Infineon Technologies AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for processing wafer
- Patent number 9,490,173
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,490,103
- Issue date Nov 8, 2016
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Separation of chips on a substrate
- Patent number 9,219,011
- Issue date Dec 22, 2015
- Infineon Technologies AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method for producing bonding connection of semiconductor device
- Patent number 9,059,182
- Issue date Jun 16, 2015
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit having a semiconductor arrangement
- Patent number 7,834,427
- Issue date Nov 16, 2010
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor structure comprising insulating l...
- Patent number 7,718,505
- Issue date May 18, 2010
- Infineon Technologies Austria AG
- Nicola Vannucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an integrated semiconductor circuit arrangement
- Patent number 7,531,439
- Issue date May 12, 2009
- Infineon Technologies AG
- Johann Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an electrode by means of a field effect contro...
- Patent number 6,605,841
- Issue date Aug 12, 2003
- Infineon Technologies AG
- Sven Lanzerstorfer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Separation of Chips on a Substrate
- Publication number 20160111255
- Publication date Apr 21, 2016
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20150235917
- Publication date Aug 20, 2015
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PROCESSING WAFER
- Publication number 20150115448
- Publication date Apr 30, 2015
- INFINEON TECHNOLOGIES AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Separation of Chips on a Substrate
- Publication number 20150064879
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Manfred Engelhardt
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Passivation Layer and Method of Making a Passivation Layer
- Publication number 20140117511
- Publication date May 1, 2014
- INFINEON TECHNOLOGIES AG
- Kurt Matoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING INSULATING L...
- Publication number 20080315303
- Publication date Dec 25, 2008
- Infineon Technologies Austria AG
- Nicola Vannucci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT
- Publication number 20080179669
- Publication date Jul 31, 2008
- Infineon Technologies Austria AG
- Thomas Detzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device for bonding connection
- Publication number 20070063318
- Publication date Mar 22, 2007
- Infineon Technologies AG
- Hubert Maier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an integrated semiconductor circuit arrangement
- Publication number 20060014371
- Publication date Jan 19, 2006
- Johann Rieger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an electrode of a field-effect-controllable se...
- Publication number 20020100923
- Publication date Aug 1, 2002
- Sven Lanzerstorfer
- H01 - BASIC ELECTRIC ELEMENTS

Hubert Maier

Person

Patents Grantslast 30 patents

Passivation layer and method of making a passivation layer

Method for processing wafer

Separation of chips on a substrate

Separation of chips on a substrate

Method for producing bonding connection of semiconductor device

Integrated circuit having a semiconductor arrangement

Method of forming a semiconductor structure comprising insulating l...

Method for forming an integrated semiconductor circuit arrangement

Method for producing an electrode by means of a field effect contro...

Patents Applicationslast 30 patents

Separation of Chips on a Substrate

Passivation Layer and Method of Making a Passivation Layer

METHOD FOR PROCESSING WAFER

Separation of Chips on a Substrate

Passivation Layer and Method of Making a Passivation Layer

METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING INSULATING L...

INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR ARRANGEMENT

Semiconductor device for bonding connection

Method for forming an integrated semiconductor circuit arrangement

Method for producing an electrode of a field-effect-controllable se...