Hubert Vander Plas

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Palo Alto, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 7,432,582
- Issue date Oct 7, 2008
- Hewlett-Packard Development Company, L.P.
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 6,902,872
- Issue date Jun 7, 2005
- Hewlett-Packard Development Company, L.P.
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of forming a through-substrate interconnect
- Patent number 6,716,737
- Issue date Apr 6, 2004
- Hewlett-Packard Development Company, L.P.
- Hubert Vander Plas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a through-substrate interconnect
- Publication number 20050101040
- Publication date May 12, 2005
- Daine Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Solder on a sloped surface
- Publication number 20040180526
- Publication date Sep 16, 2004
- Hubert Allen Vander Plas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FORMING A THROUGH-SUBSTRATE INTERCONNECT
- Publication number 20040018712
- Publication date Jan 29, 2004
- Hubert Vander Plas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a through-substrate interconnect
- Publication number 20040017419
- Publication date Jan 29, 2004
- Diane Lai
- B81 - MICRO-STRUCTURAL TECHNOLOGY