Huchang Zhang

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Tianjin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Cleaning mechanism for semiconductor singulation saws
- Patent number 9,498,898
- Issue date Nov 22, 2016
- Freescale Semiconductor,INC
- Zhijie Wang
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Die edge seal employing low-K dielectric material
- Patent number 9,406,625
- Issue date Aug 2, 2016
- Freescale Semicondcutor, Inc.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire feed system and method therefor
- Patent number 9,397,066
- Issue date Jul 19, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device grid array package
- Patent number 9,252,114
- Issue date Feb 2, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package with pre-molded die
- Patent number 9,214,413
- Issue date Dec 15, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of assembling same
- Patent number 8,735,223
- Issue date May 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE FEED SYSTEM AND METHOD THEREFOR
- Publication number 20160155718
- Publication date Jun 2, 2016
- ZHIJIE WANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CLEANING MECHANISM FOR SEMICONDUCTOR SINGULATION SAWS
- Publication number 20150367529
- Publication date Dec 24, 2015
- Zhijie Wang
- B08 - CLEANING
Information Patent Application
DIE EDGE SEAL EMPLOYING LOW-K DIELECTRIC MATERIAL
- Publication number 20150371957
- Publication date Dec 24, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE GRID ARRAY PACKAGE
- Publication number 20150243623
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE WITH PRE-MOLDED DIE
- Publication number 20150243586
- Publication date Aug 27, 2015
- Zhijie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF ASSEMBLING SAME
- Publication number 20130056861
- Publication date Mar 7, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Wei Gao
- H01 - BASIC ELECTRIC ELEMENTS