Huck Khim Koay

Person

  • Georgetown Penang, MY

Patents Grantslast 30 patents

  • Information Patent Grant

    Encapsulating brittle substrates using transfer molding

    • Patent number 7,114,939
    • Issue date Oct 3, 2006
    • Avago Technologies General IP (Singapore) Pte. Ltd.
    • Cheng Why Tan
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Light source

    • Patent number 6,806,583
    • Issue date Oct 19, 2004
    • Agilent Technologies, Inc.
    • Huck Khim Koay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method of interconnecting an electronic device

    • Patent number 6,242,280
    • Issue date Jun 5, 2001
    • Agilent Technologies, Inc.
    • Huck Khim Koay
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    Encapsulating brittle substrates using transfer molding

    • Publication number 20030194459
    • Publication date Oct 16, 2003
    • Cheng Why Tan
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    Light Source

    • Publication number 20020047130
    • Publication date Apr 25, 2002
    • Huck Khim Koay
    • H01 - BASIC ELECTRIC ELEMENTS