Huei-Jen Chen

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Yungho City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating a substrate, including a plurality of chip p...
- Patent number 7,117,587
- Issue date Oct 10, 2006
- Lite-On Semiconductor Corp.
- Huei-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package substrate having soft circuit board and method for fab...
- Patent number 7,075,176
- Issue date Jul 11, 2006
- Lite-On Semiconductor Corp.
- Huei-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Chip package substrate having soft circuit board and method for fab...
- Publication number 20060006487
- Publication date Jan 12, 2006
- LITE-ON SEMICONDUCTOR CORP.
- Huei-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip package substrate having soft circuit board and method for fab...
- Publication number 20050001278
- Publication date Jan 6, 2005
- Huei-Jen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR