Huei-Ping Hsieh

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Ruthenium-based liner for a copper interconnect
- Patent number 12,094,770
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yao-Min Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 12,080,594
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bi-layer alloy liner for interconnect metallization and methods of...
- Patent number 11,854,878
- Issue date Dec 26, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING LTD.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods and apparatuses for forming the...
- Patent number 11,694,899
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally stable copper-alloy adhesion layer for metal interconnect...
- Patent number 11,430,692
- Issue date Aug 30, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making IC capacitor
- Patent number 6,677,216
- Issue date Jan 13, 2004
- Mosel Vitelic, Inc.
- Chun-Pey Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240395617
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20240387256
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...
- Publication number 20240079270
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20230317459
- Publication date Oct 5, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chun-Hsu Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT
- Publication number 20230068398
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yao-Min LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20220384255
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220367262
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...
- Publication number 20220367265
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...
- Publication number 20220037203
- Publication date Feb 3, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Cheng-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods and Apparatuses for Forming the...
- Publication number 20210217622
- Publication date Jul 15, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hsu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BI-LAYER LINER FOR METALLIZATION
- Publication number 20210202310
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Huei-Wen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making IC capacitor
- Publication number 20030068868
- Publication date Apr 10, 2003
- MOSEL VITELIC, INC.
- Chun-Pey Cho
- H01 - BASIC ELECTRIC ELEMENTS

Huei-Ping Hsieh

Person

Patents Grantslast 30 patents

Ruthenium-based liner for a copper interconnect

Thermally stable copper-alloy adhesion layer for metal interconnect...

Bi-layer alloy liner for interconnect metallization and methods of...

Interconnect structures and methods and apparatuses for forming the...

Thermally stable copper-alloy adhesion layer for metal interconnect...

Method of making IC capacitor

Patents Applicationslast 30 patents

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

Bl-LAYER ALLOY LINER FOR INTERCONNECT METALLIZATION AND METHODS OF...

Interconnect Structures and Methods and Apparatuses for Forming the...

RUTHENIUM-BASED LINER FOR A COPPER INTERCONNECT

Interconnect Structures and Methods and Apparatuses for Forming the...

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Bi-Layer Alloy Liner For Interconnect Metallization And Methods Of...

THERMALLY STABLE COPPER-ALLOY ADHESION LAYER FOR METAL INTERCONNECT...

Interconnect Structures and Methods and Apparatuses for Forming the...

BI-LAYER LINER FOR METALLIZATION

Method of making IC capacitor