Huei-Wen YANG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,125,782
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and electronic device for saving power applied to a router
- Patent number 11,805,054
- Issue date Oct 31, 2023
- Mediatek Inc.
- Yu-Hua Huang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor structure and method of forming semiconductor package
- Patent number 11,587,863
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device-to-device subscriber identity module sharing method and asso...
- Patent number 11,388,599
- Issue date Jul 12, 2022
- Mediatek Inc.
- Wei-Lun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,867,903
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for copper interconnect
- Patent number 9,112,004
- Issue date Aug 18, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layer for copper interconnect
- Patent number 8,653,663
- Issue date Feb 18, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Experiment management system and method thereof in semiconductor ma...
- Patent number 7,133,735
- Issue date Nov 7, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chang Kuo
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240371746
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KUANG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING
- Publication number 20240038486
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME
- Publication number 20240038605
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Ching Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ELECTRONIC DEVICE FOR SAVING POWER APPLIED TO A ROUTER
- Publication number 20230336472
- Publication date Oct 19, 2023
- MEDIATEK INC.
- Yu-Hua HUANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20230207450
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KUANG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR PACKAGE
- Publication number 20210118795
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KUANG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE-TO-DEVICE SUBSCRIBER IDENTITY MODULE SHARING METHOD AND ASSO...
- Publication number 20200359211
- Publication date Nov 12, 2020
- MEDIATEK INC.
- Wei-Lun Liu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20200035596
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-KUANG KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier Layer for Copper Interconnect
- Publication number 20140106562
- Publication date Apr 17, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuang Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER LAYER FOR COPPER INTERCONNECT
- Publication number 20110101529
- Publication date May 5, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Kuang KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Experiment management system and method thereof in semiconductor ma...
- Publication number 20060167578
- Publication date Jul 27, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chang Kuo
- G05 - CONTROLLING REGULATING

Huei-Wen YANG

Person

Patents Grantslast 30 patents

Semiconductor structure and method of forming the same

Method and electronic device for saving power applied to a router

Semiconductor structure and method of forming semiconductor package

Device-to-device subscriber identity module sharing method and asso...

Semiconductor package and method of forming the same

Barrier layer for copper interconnect

Barrier layer for copper interconnect

Experiment management system and method thereof in semiconductor ma...

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

METHOD AND APPARATUS FOR PREPARING SAMPLES FOR IMAGING

SEMICONDUCTOR STRUCTURE WITH TESTLINE AND METHOD OF FABRICATING SAME

METHOD AND ELECTRONIC DEVICE FOR SAVING POWER APPLIED TO A ROUTER

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING SEMICONDUCTOR PACKAGE

DEVICE-TO-DEVICE SUBSCRIBER IDENTITY MODULE SHARING METHOD AND ASSO...

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

Barrier Layer for Copper Interconnect

BARRIER LAYER FOR COPPER INTERCONNECT

Experiment management system and method thereof in semiconductor ma...