Hueng Jae Oh

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Lead pin for package substrate
- Patent number 9,142,499
- Issue date Sep 22, 2015
- Samsung Electro-Machanics Co., Ltd.
- Ki Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method for manufacturing the same
- Patent number 8,785,789
- Issue date Jul 22, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin for package substrate
- Patent number 8,766,450
- Issue date Jul 1, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Ki Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball supplying apparatus
- Patent number 8,708,215
- Issue date Apr 29, 2014
- Samsung Electro-Machanics Co., Ltd.
- Hueng Jae Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for flip chip bonding and method of fabricating the same
- Patent number 8,671,564
- Issue date Mar 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming apparatus and soldering facility including the...
- Patent number 8,651,356
- Issue date Feb 18, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki Mukai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing substrate for flip chip and substrate for f...
- Patent number 8,486,760
- Issue date Jul 16, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Tae Joon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead pin for package boards
- Patent number 7,893,355
- Issue date Feb 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD PIN FOR PACKAGE SUBSTRATE
- Publication number 20140291851
- Publication date Oct 2, 2014
- Ki Taek LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME
- Publication number 20140138821
- Publication date May 22, 2014
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hueng Jae OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL SUPPLYING APPARATUS
- Publication number 20130306709
- Publication date Nov 21, 2013
- Samsung Electro-mechanics Co., Ltd.
- Hueng Jae Oh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130161085
- Publication date Jun 27, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Hueng Jae Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...
- Publication number 20130134208
- Publication date May 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki MUKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...
- Publication number 20130134207
- Publication date May 30, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Noriaki MUKAI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing substrate for flip chip and substrate for f...
- Publication number 20110079926
- Publication date Apr 7, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Tae Joon Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead pin for package substrate
- Publication number 20110068473
- Publication date Mar 24, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Ki Taek Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME
- Publication number 20100314161
- Publication date Dec 16, 2010
- Hueng Jae OH
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100271792
- Publication date Oct 28, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jin-Won Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead pin for package boards
- Publication number 20100000761
- Publication date Jan 7, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hueng Jae Oh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Hueng Jae Oh

Person

Patents Grantslast 30 patents

Lead pin for package substrate

Printed circuit board and method for manufacturing the same

Lead pin for package substrate

Solder ball supplying apparatus

Substrate for flip chip bonding and method of fabricating the same

Solder bump forming apparatus and soldering facility including the...

Method of manufacturing substrate for flip chip and substrate for f...

Lead pin for package boards

Patents Applicationslast 30 patents

LEAD PIN FOR PACKAGE SUBSTRATE

SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME

SOLDER BALL SUPPLYING APPARATUS

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...

SOLDER BUMP FORMING APPARATUS AND SOLDERING FACILITY INCLUDING THE...

Method of manufacturing substrate for flip chip and substrate for f...

Lead pin for package substrate

SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Lead pin for package boards