Hugo Chi Wai Wong

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Tsung Kwan O, N.T., HK

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Patents Grantslast 30 patents

Information Patent Grant
Premolded cavity IC package
- Patent number 6,821,817
- Issue date Nov 23, 2004
- ASAT Ltd.
- Labeeb Sadak Thamby
- H01 - BASIC ELECTRIC ELEMENTS