Hui Bin Huang

Person

  • Monroeville, NJ, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Method of forming leveraged poromeric polishing pad

    • Patent number 11,667,061
    • Issue date Jun 6, 2023
    • Rohm and Haas Electronic Materials CMP Holdings, Inc.
    • Wei-Wen Tsai
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Grant

    Tapering method for poromeric polishing pad

    • Patent number 10,259,099
    • Issue date Apr 16, 2019
    • Rohm and Haas Electronic Materials CMP Holdings, Inc.
    • Koichi Yoshida
    • B24 - GRINDING POLISHING
  • Information Patent Grant

    Tapered poromeric polishing pad

    • Patent number 9,925,637
    • Issue date Mar 27, 2018
    • Rohm and Haas Electronic Materials CMP Holdings, Inc.
    • Koichi Yoshida
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    OFFSET PORE POROMERIC POLISHING PAD

    • Publication number 20210323116
    • Publication date Oct 21, 2021
    • Rohm and Haas Electronic Materials CMP Holdings, INC.
    • Wei-Wen TSAI
    • B24 - GRINDING POLISHING
  • Information Patent Application

    LEVERAGED POROMERIC POLISHING PAD

    • Publication number 20210323115
    • Publication date Oct 21, 2021
    • Rohm and Haas Electronic Materials CMP Holdings, INC.
    • Wei-Wen TSAI
    • B24 - GRINDING POLISHING
  • Information Patent Application

    METHOD OF FORMING LEVERAGED POROMERIC POLISHING PAD

    • Publication number 20210323202
    • Publication date Oct 21, 2021
    • Rohm and Haas Electronic Materials CMP Holdings, INC.
    • Wei-Wen TSAI
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    TAPERING METHOD FOR POROMERIC POLISHING PAD

    • Publication number 20180036860
    • Publication date Feb 8, 2018
    • Rohm and Haas Electronic Materials CMP Holdings, INC.
    • Koichi Yoshida
    • B24 - GRINDING POLISHING
  • Information Patent Application

    TAPERED POROMERIC POLISHING PAD

    • Publication number 20180036862
    • Publication date Feb 8, 2018
    • Rohm and Haas Electronic Materials CMP Holdings, INC.
    • Koichi Yoshida
    • B24 - GRINDING POLISHING