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Hui Bin Huang
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Monroeville, NJ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method of forming leveraged poromeric polishing pad
Patent number
11,667,061
Issue date
Jun 6, 2023
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Wei-Wen Tsai
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Tapering method for poromeric polishing pad
Patent number
10,259,099
Issue date
Apr 16, 2019
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Koichi Yoshida
B24 - GRINDING POLISHING
Information
Patent Grant
Tapered poromeric polishing pad
Patent number
9,925,637
Issue date
Mar 27, 2018
Rohm and Haas Electronic Materials CMP Holdings, Inc.
Koichi Yoshida
B24 - GRINDING POLISHING
Patents Applications
last 30 patents
Information
Patent Application
OFFSET PORE POROMERIC POLISHING PAD
Publication number
20210323116
Publication date
Oct 21, 2021
Rohm and Haas Electronic Materials CMP Holdings, INC.
Wei-Wen TSAI
B24 - GRINDING POLISHING
Information
Patent Application
LEVERAGED POROMERIC POLISHING PAD
Publication number
20210323115
Publication date
Oct 21, 2021
Rohm and Haas Electronic Materials CMP Holdings, INC.
Wei-Wen TSAI
B24 - GRINDING POLISHING
Information
Patent Application
METHOD OF FORMING LEVERAGED POROMERIC POLISHING PAD
Publication number
20210323202
Publication date
Oct 21, 2021
Rohm and Haas Electronic Materials CMP Holdings, INC.
Wei-Wen TSAI
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
TAPERING METHOD FOR POROMERIC POLISHING PAD
Publication number
20180036860
Publication date
Feb 8, 2018
Rohm and Haas Electronic Materials CMP Holdings, INC.
Koichi Yoshida
B24 - GRINDING POLISHING
Information
Patent Application
TAPERED POROMERIC POLISHING PAD
Publication number
20180036862
Publication date
Feb 8, 2018
Rohm and Haas Electronic Materials CMP Holdings, INC.
Koichi Yoshida
B24 - GRINDING POLISHING