Hui Chi Liu

Person

Kaohsiung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic package structure
- Patent number 12,184,266
- Issue date Dec 31, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device package
- Patent number 11,817,397
- Issue date Nov 14, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method of manufacturing the same
- Patent number 11,588,470
- Issue date Feb 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Optical package structure and method of manufacturing the same
- Patent number 11,527,671
- Issue date Dec 13, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,296,651
- Issue date Apr 5, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,217,499
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame and method for manufacturing the same
- Patent number 11,088,054
- Issue date Aug 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 10,812,017
- Issue date Oct 20, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lead frame structure
- Patent number 6,204,553
- Issue date Mar 20, 2001
- Walsin Advanced Electronics Ltd.
- Wen-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20230208394
- Publication date Jun 29, 2023
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BODY-PART TRACKING DEVICE AND BODY-PART TRACKING METHOD
- Publication number 20220404908
- Publication date Dec 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220199550
- Publication date Jun 23, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210358823
- Publication date Nov 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210257988
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
OPTICAL PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210202780
- Publication date Jul 1, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082791
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210036658
- Publication date Feb 4, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20200402879
- Publication date Dec 24, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng TSENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Film and chip packaging process using the same
- Publication number 20080113472
- Publication date May 15, 2008
- Yueh Ming Tung
- H01 - BASIC ELECTRIC ELEMENTS

Hui Chi Liu

Person

Patents Grantslast 30 patents

Electronic package structure

Semiconductor device package

Semiconductor package structure and method of manufacturing the same

Optical package structure and method of manufacturing the same

Semiconductor package structure

Semiconductor package structure and method for manufacturing the same

Lead frame and method for manufacturing the same

Semiconductor package structure

Lead frame structure

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE STRUCTURE

BODY-PART TRACKING DEVICE AND BODY-PART TRACKING METHOD

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

OPTICAL PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Film and chip packaging process using the same