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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package and method of fabricating the same
Patent number
11,935,871
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure and method for forming the same
Patent number
11,715,646
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Jen-Fu Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
Publication number
20230378140
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230326766
Publication date
Oct 12, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-FU LIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230060720
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hao-Yi Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
Publication number
20230015970
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing company Ltd.
JEN-FU LIU
H01 - BASIC ELECTRIC ELEMENTS