HUI-CHUN CHIANG

Person

HSINCHU, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of fabricating semiconductor package
- Patent number 12,266,639
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising various via structures
- Patent number 12,087,597
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,935,871
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for forming the same
- Patent number 11,715,646
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Jen-Fu Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES
- Publication number 20240363364
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-FU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Methods of Forming the Same
- Publication number 20240304535
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20240234375
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20230378140
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230326766
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-FU LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230060720
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Yi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230015970
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- JEN-FU LIU
- H01 - BASIC ELECTRIC ELEMENTS

HUI-CHUN CHIANG

Person

Patents Grantslast 30 patents

Method of fabricating semiconductor package

Semiconductor structure comprising various via structures

Semiconductor package and method of fabricating the same

Semiconductor structure and method for forming the same

Patents Applicationslast 30 patents

SEMICONDUCTOR STRUCTURE COMPRISING VARIOUS VIA STRUCTURES

Integrated Circuit Package and Methods of Forming the Same

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME