Hui FU

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Vacuumizing device and vacuumizing method for bonding substrate
- Patent number 11,664,228
- Issue date May 30, 2023
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuangen Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding device
- Patent number 10,780,684
- Issue date Sep 22, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Hui Fu
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
VACUUMIZING DEVICE AND VACUUMIZING METHOD
- Publication number 20200168459
- Publication date May 28, 2020
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Yuangen YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING DEVICE
- Publication number 20190131149
- Publication date May 2, 2019
- SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD.
- Hui FU
- H01 - BASIC ELECTRIC ELEMENTS