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Taoyuan City, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,942,563
Issue date
Mar 26, 2024
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,705,368
Issue date
Jul 18, 2023
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Low-thermal resistance pressing device for a socket
Patent number
11,630,147
Issue date
Apr 18, 2023
CHROMA ATE INC.
Ming Cheng Huang
G01 - MEASURING TESTING
Information
Patent Grant
Optical chip package and method for forming the same
Patent number
11,137,559
Issue date
Oct 5, 2021
Xintec Inc.
Jiun-Yen Lai
G02 - OPTICS
Information
Patent Grant
Manufacturing method of chip package and chip package
Patent number
11,121,031
Issue date
Sep 14, 2021
Xintec Inc.
Chia-Sheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
9,947,716
Issue date
Apr 17, 2018
Xintec Inc.
Yen-Shih Ho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package and manufacturing method thereof
Patent number
9,875,912
Issue date
Jan 23, 2018
Xintec Inc.
Yen-Shih Ho
G06 - COMPUTING CALCULATING COUNTING
Patents Applications
last 30 patents
Information
Patent Application
Low-thermal resistance pressing device for a socket
Publication number
20220206059
Publication date
Jun 30, 2022
CHROMA ATE INC.
Ming Cheng HUANG
G01 - MEASURING TESTING
Information
Patent Application
CHIP-FIXING DEVICE FOR A SOCKET
Publication number
20220200185
Publication date
Jun 23, 2022
CHROMA ATE INC.
HUI-JUNG WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
Publication number
20210343591
Publication date
Nov 4, 2021
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
Publication number
20200333542
Publication date
Oct 22, 2020
XINTEC INC.
Jiun-Yen LAI
G02 - OPTICS
Information
Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
Publication number
20200144116
Publication date
May 7, 2020
XINTEC INC.
Chia-Sheng LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20170148844
Publication date
May 25, 2017
XINTEC INC.
Yen-Shih HO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20170148694
Publication date
May 25, 2017
XINTEC INC.
Yen-Shih HO
H01 - BASIC ELECTRIC ELEMENTS