Hui-Hsien WU

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip-fixing device for a socket
- Patent number 12,142,868
- Issue date Nov 12, 2024
- CHROMA ATE INC.
- Hui-Jung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,942,563
- Issue date Mar 26, 2024
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,705,368
- Issue date Jul 18, 2023
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-thermal resistance pressing device for a socket
- Patent number 11,630,147
- Issue date Apr 18, 2023
- CHROMA ATE INC.
- Ming Cheng Huang
- G01 - MEASURING TESTING
Information Patent Grant
Optical chip package and method for forming the same
- Patent number 11,137,559
- Issue date Oct 5, 2021
- Xintec Inc.
- Jiun-Yen Lai
- G02 - OPTICS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,121,031
- Issue date Sep 14, 2021
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,947,716
- Issue date Apr 17, 2018
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,875,912
- Issue date Jan 23, 2018
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Low-thermal resistance pressing device for a socket
- Publication number 20220206059
- Publication date Jun 30, 2022
- CHROMA ATE INC.
- Ming Cheng HUANG
- G01 - MEASURING TESTING
Information Patent Application
CHIP-FIXING DEVICE FOR A SOCKET
- Publication number 20220200185
- Publication date Jun 23, 2022
- CHROMA ATE INC.
- HUI-JUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20210343591
- Publication date Nov 4, 2021
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20200333542
- Publication date Oct 22, 2020
- XINTEC INC.
- Jiun-Yen LAI
- G02 - OPTICS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20200144116
- Publication date May 7, 2020
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148844
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170148694
- Publication date May 25, 2017
- XINTEC INC.
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS

Hui-Hsien WU

Person

Patents Grantslast 30 patents

Chip-fixing device for a socket

Manufacturing method of chip package and chip package

Manufacturing method of chip package and chip package

Low-thermal resistance pressing device for a socket

Optical chip package and method for forming the same

Manufacturing method of chip package and chip package

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Patents Applicationslast 30 patents

Low-thermal resistance pressing device for a socket

CHIP-FIXING DEVICE FOR A SOCKET

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

OPTICAL CHIP PACKAGE AND METHOD FOR FORMING THE SAME

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF