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Hui Hua LEE

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  • Kaohsiung, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20210020594
    • Publication date Jan 21, 2021
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Tsung CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20200243427
    • Publication date Jul 30, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Hui Hua LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20200194356
    • Publication date Jun 18, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Hui Hua LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20200194327
    • Publication date Jun 18, 2020
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Tsung CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20190122969
    • Publication date Apr 25, 2019
    • Advanced Semiconductor Engineering, Inc.
    • Hui Hua LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20180358276
    • Publication date Dec 13, 2018
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Tsung CHIU
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20170365543
    • Publication date Dec 21, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Hui Hua LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20170365542
    • Publication date Dec 21, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Kay Stefan ESSIG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE PACKAGE
    • Publication number 20170148746
    • Publication date May 25, 2017
    • Advanced Semiconductor Engineering, Inc.
    • Chi-Tsung CHIU
    • H01 - BASIC ELECTRIC ELEMENTS