Hui Jae YOO

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Transistors, memory cells, and arrangements thereof
- Patent number 12,148,734
- Issue date Nov 19, 2024
- Intel Corporation
- Sarah Atanasov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 12,148,806
- Issue date Nov 19, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistors having a backside channel contact for high de...
- Patent number 12,150,297
- Issue date Nov 19, 2024
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of thin film fin transistor structure
- Patent number 12,080,781
- Issue date Sep 3, 2024
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside contacts for semiconductor devices
- Patent number 12,080,605
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 12,040,226
- Issue date Jul 16, 2024
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial layer with substantially parallel sides
- Patent number 12,020,929
- Issue date Jun 25, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-height and multi-width interconnect line metallization for in...
- Patent number 12,002,754
- Issue date Jun 4, 2024
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked forksheet transistors
- Patent number 11,996,411
- Issue date May 28, 2024
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layers for thin film transistors and methods of fabrica...
- Patent number 11,955,560
- Issue date Apr 9, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sideways vias in isolation areas to contact interior layers in stac...
- Patent number 11,942,416
- Issue date Mar 26, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 11,916,118
- Issue date Feb 27, 2024
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect wires including relatively low resistivity cores
- Patent number 11,881,432
- Issue date Jan 23, 2024
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structures for stacked device connectivity and their...
- Patent number 11,869,894
- Issue date Jan 9, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compute near memory with backend memory
- Patent number 11,812,599
- Issue date Nov 7, 2023
- Intel Corporation
- Abhishek Sharma
- G11 - INFORMATION STORAGE
Information Patent Grant
Capacitance reduction for semiconductor devices based on wafer bonding
- Patent number 11,798,838
- Issue date Oct 24, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including air gapping of gate spacers and other dielectrics...
- Patent number 11,769,814
- Issue date Sep 26, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around integrated circuit structures having depopulated ch...
- Patent number 11,764,263
- Issue date Sep 19, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming an oxide volume within a fin
- Patent number 11,764,104
- Issue date Sep 19, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module having a stacked logic chip and memory stack
- Patent number 11,699,681
- Issue date Jul 11, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 11,670,545
- Issue date Jun 6, 2023
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically stacked memory elements with air gap
- Patent number 11,672,133
- Issue date Jun 6, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked source-drain-gate connection and process for forming such
- Patent number 11,646,352
- Issue date May 9, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-V source/drain in top NMOS transistors for low temperature stac...
- Patent number 11,640,961
- Issue date May 2, 2023
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to fabricate metal and ferromagnetic metal multilayer interc...
- Patent number 11,605,592
- Issue date Mar 14, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional integrated circuits with stacked transistors
- Patent number 11,605,565
- Issue date Mar 14, 2023
- Intel Corporation
- Cheng-Ying Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two terminal spin orbit memory devices and methods of fabrication
- Patent number 11,594,673
- Issue date Feb 28, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal low temperature hermetic dielectric diffusion barriers
- Patent number 11,587,827
- Issue date Feb 21, 2023
- Intel Corporation
- Sean King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device with air-gaps to reduce coupling capacitance and process for...
- Patent number 11,574,910
- Issue date Feb 7, 2023
- Intel Corporation
- Abhishek Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20240371700
- Publication date Nov 7, 2024
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...
- Publication number 20240304549
- Publication date Sep 12, 2024
- Intel Corporation
- Hui Jae Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20240282624
- Publication date Aug 22, 2024
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...
- Publication number 20240234579
- Publication date Jul 11, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED FORKSHEET TRANSISTORS
- Publication number 20240234422
- Publication date Jul 11, 2024
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STAC...
- Publication number 20240162141
- Publication date May 16, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SOURCE-DRAIN-GATE CONNECTION AND PROCESS FOR FORMING SUCH
- Publication number 20240145557
- Publication date May 2, 2024
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20240112952
- Publication date Apr 4, 2024
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING AN OXIDE VOLUME WITHIN A FIN
- Publication number 20230377947
- Publication date Nov 23, 2023
- Intel Corporation
- Cheng-Ying HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CH...
- Publication number 20230369399
- Publication date Nov 16, 2023
- Intel Corporation
- Ehren Mannebach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20230260833
- Publication date Aug 17, 2023
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SOURCE-DRAIN-GATE CONNECTION AND PROCESS FOR FORMING SUCH
- Publication number 20230238436
- Publication date Jul 27, 2023
- Intel Corporation
- Ehren MANNEBACH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES
- Publication number 20230130273
- Publication date Apr 27, 2023
- Intel Corporation
- HUI JAE YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAPHITIC CARBON CONTACTS FOR DEVICES WITH OXIDE CHANNELS
- Publication number 20230102219
- Publication date Mar 30, 2023
- Intel Corporation
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED THERMOELECTRIC DEVICE TO MITIGATE INTEGRATED CIRCUIT HOT...
- Publication number 20230091603
- Publication date Mar 23, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL TRANSISTOR WITH FIN-SHAPED GATE
- Publication number 20230092244
- Publication date Mar 23, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN-FILM TRANSISTORS WITH SHARED CONTACTS
- Publication number 20230093064
- Publication date Mar 23, 2023
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MEMORY STRUCTURE WITH DUAL-CHANNEL TRANSISTOR
- Publication number 20230081882
- Publication date Mar 16, 2023
- Intel Corporation
- Sean T. Ma
- G11 - INFORMATION STORAGE
Information Patent Application
TWO TRANSISTOR CAPACITORLESS MEMORY CELL WITH STACKED THIN-FILM TRA...
- Publication number 20230084611
- Publication date Mar 16, 2023
- Intel Corporation
- Noriyuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER MEMORY STACKING WITH COMPUTER LOGIC CIRCUITS SHARED BETWEEN...
- Publication number 20230064541
- Publication date Mar 2, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...
- Publication number 20230067765
- Publication date Mar 2, 2023
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED RANDOM-ACCESS MEMORY DEVICES
- Publication number 20230056640
- Publication date Feb 23, 2023
- Intel Corporation
- Abhishek A. Sharma
- G11 - INFORMATION STORAGE
Information Patent Application
BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY
- Publication number 20220415904
- Publication date Dec 29, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS
- Publication number 20220406782
- Publication date Dec 22, 2022
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED BACKEND MEMORY WITH RESISTIVE SWITCHING DEVICES
- Publication number 20220392957
- Publication date Dec 8, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES
- Publication number 20220352032
- Publication date Nov 3, 2022
- Intel Corporation
- Aaron D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS
- Publication number 20220344201
- Publication date Oct 27, 2022
- Intel Corporation
- Sean KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STRUCTURES FOR STACKED DEVICE CONNECTIVITY AND THEIR...
- Publication number 20220344376
- Publication date Oct 27, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS

Hui Jae YOO

Person

Patents Grantslast 30 patents

Transistors, memory cells, and arrangements thereof

Stacked source-drain-gate connection and process for forming such

Thin film transistors having a backside channel contact for high de...

Fabrication of thin film fin transistor structure

Backside contacts for semiconductor devices

Conformal low temperature hermetic dielectric diffusion barriers

Subtractively patterned interconnect structures for integrated circ...

Epitaxial layer with substantially parallel sides

Multi-height and multi-width interconnect line metallization for in...

Stacked forksheet transistors

Passivation layers for thin film transistors and methods of fabrica...

Sideways vias in isolation areas to contact interior layers in stac...

Stacked source-drain-gate connection and process for forming such

Interconnect wires including relatively low resistivity cores

Metallization structures for stacked device connectivity and their...

Compute near memory with backend memory

Capacitance reduction for semiconductor devices based on wafer bonding

Device including air gapping of gate spacers and other dielectrics...

Gate-all-around integrated circuit structures having depopulated ch...

Forming an oxide volume within a fin

Multi-chip module having a stacked logic chip and memory stack

Conformal low temperature hermetic dielectric diffusion barriers

Vertically stacked memory elements with air gap

Stacked source-drain-gate connection and process for forming such

III-V source/drain in top NMOS transistors for low temperature stac...

Method to fabricate metal and ferromagnetic metal multilayer interc...

Three dimensional integrated circuits with stacked transistors

Two terminal spin orbit memory devices and methods of fabrication

Conformal low temperature hermetic dielectric diffusion barriers

Device with air-gaps to reduce coupling capacitance and process for...

Patents Applicationslast 30 patents

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

MULTI-HEIGHT & MULTI-WIDTH INTERCONNECT LINE METALLIZATION FOR INTE...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

PASSIVATION LAYERS FOR THIN FILM TRANSISTORS AND METHODS OF FABRICA...

STACKED FORKSHEET TRANSISTORS

SIDEWAYS VIAS IN ISOLATION AREAS TO CONTACT INTERIOR LAYERS IN STAC...

STACKED SOURCE-DRAIN-GATE CONNECTION AND PROCESS FOR FORMING SUCH

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

FORMING AN OXIDE VOLUME WITHIN A FIN

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DEPOPULATED CH...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

STACKED SOURCE-DRAIN-GATE CONNECTION AND PROCESS FOR FORMING SUCH

INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES

GRAPHITIC CARBON CONTACTS FOR DEVICES WITH OXIDE CHANNELS

INTEGRATED THERMOELECTRIC DEVICE TO MITIGATE INTEGRATED CIRCUIT HOT...

THREE-DIMENSIONAL TRANSISTOR WITH FIN-SHAPED GATE

THIN-FILM TRANSISTORS WITH SHARED CONTACTS

STACKED MEMORY STRUCTURE WITH DUAL-CHANNEL TRANSISTOR

TWO TRANSISTOR CAPACITORLESS MEMORY CELL WITH STACKED THIN-FILM TRA...

BILAYER MEMORY STACKING WITH COMPUTER LOGIC CIRCUITS SHARED BETWEEN...

BILAYER MEMORY STACKING WITH LINES SHARED BETWEEN BOTTOM AND TOP ME...

STACKED RANDOM-ACCESS MEMORY DEVICES

BACK-SIDE REVEAL FOR POWER DELIVERY TO BACKEND MEMORY

BACKEND MEMORY WITH AIR GAPS IN UPPER METAL LAYERS

STACKED BACKEND MEMORY WITH RESISTIVE SWITCHING DEVICES

BACKSIDE CONTACTS FOR SEMICONDUCTOR DEVICES

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

CONFORMAL LOW TEMPERATURE HERMETIC DIELECTRIC DIFFUSION BARRIERS

METALLIZATION STRUCTURES FOR STACKED DEVICE CONNECTIVITY AND THEIR...