HUI-JU TSAI

Person

TAINAN CITY, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor structures and method of manufacturing the same
- Patent number 11,961,811
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,246
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment holder and testing apparatus
- Patent number 11,823,936
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,823,969
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,789,366
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 11,756,879
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process including a re-etching process for forming a semiconductor...
- Patent number 11,742,317
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,670,582
- Issue date Jun 6, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,664,325
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processes for reducing leakage and improving adhesion
- Patent number 11,651,994
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 11,646,281
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming RDLS and structure formed thereof
- Patent number 11,600,574
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 11,587,902
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,557,561
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having via sidewall adhesion with encapsulant
- Patent number 11,527,466
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit, package structure, and manufacturing method of...
- Patent number 11,515,276
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with enlarged through-vias in encapsulant
- Patent number 11,515,224
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having taper-shaped conductive pillar and method...
- Patent number 11,508,633
- Issue date Nov 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,488,908
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 11,450,641
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dense redistribution layers in semiconductor packages and methods o...
- Patent number 11,417,604
- Issue date Aug 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method
- Patent number 11,404,308
- Issue date Aug 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing resist layer, and method of manufacturing semic...
- Patent number 11,378,886
- Issue date Jul 5, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package and method for tes...
- Patent number 11,335,579
- Issue date May 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bauhinia extract and uses thereof
- Patent number 11,311,592
- Issue date Apr 26, 2022
- Academia Sinica
- Chang-Jen Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,251,121
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of fabricating the same
- Patent number 11,244,906
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holding mechanism, process system and manufacturing metho...
- Patent number 11,232,971
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing process thereof
- Patent number 11,171,016
- Issue date Nov 9, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Feng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,158,775
- Issue date Oct 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240105901
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPERATING METHOD FOR ELECTRONIC DEVICE
- Publication number 20240063929
- Publication date Feb 22, 2024
- InnoCare Optoelectronics Corporation
- Hui-Ru Tsai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20230384684
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SEMICONDUCTOR STRUCTURES
- Publication number 20230378111
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT
- Publication number 20230369153
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process Including a Re-etching Process for Forming a Semiconductor...
- Publication number 20230352442
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company Co., Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
- Publication number 20230275030
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processes for Reducing Leakage and Improving Adhesion
- Publication number 20230274976
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yun Chen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230260898
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming RDLS and Structure Formed Thereof
- Publication number 20230207478
- Publication date Jun 29, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Via Sidewall Adhesion with Encapsulant
- Publication number 20230115729
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230111006
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF
- Publication number 20230054148
- Publication date Feb 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...
- Publication number 20230048907
- Publication date Feb 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220384354
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME
- Publication number 20220367409
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING REDISTRIBUTION LAYER STRUCTURE
- Publication number 20220359359
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dense Redistribution Layers in Semiconductor Packages and Methods o...
- Publication number 20220352086
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Enlarged Through-Vias in Encapsulant
- Publication number 20220336307
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Co, LTD.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220320319
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-TE CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME
- Publication number 20220320039
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220310542
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220299880
- Publication date Sep 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
ALIGNMENT HOLDER AND TESTING APPARATUS
- Publication number 20220238364
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220173033
- Publication date Jun 2, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20220165675
- Publication date May 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Sung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...
- Publication number 20220100097
- Publication date Mar 31, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...
- Publication number 20220068864
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20220045254
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...
- Publication number 20210375708
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Jui Kuo
- H01 - BASIC ELECTRIC ELEMENTS

HUI-JU TSAI

Person

Patents Grantslast 30 patents

Semiconductor structures and method of manufacturing the same

Semiconductor device and method

Alignment holder and testing apparatus

Packages with enlarged through-vias in encapsulant

Method for removing resist layer, and method of manufacturing semic...

Semiconductor devices and methods of manufacturing the same

Process including a re-etching process for forming a semiconductor...

Package structure and method of fabricating the same

Semiconductor structure and method of fabricating the same

Processes for reducing leakage and improving adhesion

Semiconductor structures

Method of forming RDLS and structure formed thereof

Semiconductor structure and method of forming the same

Package structure and method of fabricating the same

Semiconductor device having via sidewall adhesion with encapsulant

Integrated circuit, package structure, and manufacturing method of...

Packages with enlarged through-vias in encapsulant

Package structure having taper-shaped conductive pillar and method...

Semiconductor device and method

Method of fabricating package structure

Dense redistribution layers in semiconductor packages and methods o...

Semiconductor package and method

Method for removing resist layer, and method of manufacturing semic...

Method for manufacturing a semiconductor package and method for tes...

Bauhinia extract and uses thereof

Package structure and method of fabricating the same

Semiconductor structure and method of fabricating the same

Workpiece holding mechanism, process system and manufacturing metho...

Semiconductor package and manufacturing process thereof

Semiconductor device and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD

OPERATING METHOD FOR ELECTRONIC DEVICE

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

SEMICONDUCTOR STRUCTURES

PACKAGES WITH ENLARGED THROUGH-VIAS IN ENCAPSULANT

Process Including a Re-etching Process for Forming a Semiconductor...

METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE

Processes for Reducing Leakage and Improving Adhesion

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Method of Forming RDLS and Structure Formed Thereof

Semiconductor Device Having Via Sidewall Adhesion with Encapsulant

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...

Semiconductor Device and Method

PACKAGE STRUCTURE AND METHOD OF FABRCATING THE SAME

METHOD OF FORMING REDISTRIBUTION LAYER STRUCTURE

Dense Redistribution Layers in Semiconductor Packages and Methods o...

Packages with Enlarged Through-Vias in Encapsulant

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR PACKAGES AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURES AND METHOD OF MANUFACTURING THE SAME

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

ALIGNMENT HOLDER AND TESTING APPARATUS

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD FOR REMOVING RESISTOR LAYER, AND METHOD OF MANUFACTURING SEM...

INTEGRATED CIRCUIT, PACKAGE STRUCTURE, AND MANUFACTURING METHOD OF...

Semiconductor Device and Method

PACKAGE STRUCTURE HAVING TAPER-SHAPED CONDUCTIVE PILLAR AND METHOD...