Hui-Mei JAO

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Tainan City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming shallow trench isolation structure
- Patent number 9,368,387
- Issue date Jun 14, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Yung Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soft material wafer bonding and method of bonding
- Patent number 8,748,885
- Issue date Jun 10, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer and method of processing wafer
- Patent number 8,592,297
- Issue date Nov 26, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti Yeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING SHALLOW TRENCH ISOLATION STRUCTURE
- Publication number 20160005669
- Publication date Jan 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tai-Yung YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOFT MATERIAL WAFER BONDING AND METHOD OF BONDING
- Publication number 20130207098
- Publication date Aug 15, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER AND METHOD OF PROCESSING WAFER
- Publication number 20130154060
- Publication date Jun 20, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Ti YEH
- H01 - BASIC ELECTRIC ELEMENTS