Hui-Mei Wu

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Juhdong Township, TW

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of an image sensor module
- Patent number 7,572,676
- Issue date Aug 11, 2009
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and method of an image sensor module
- Patent number 7,411,306
- Issue date Aug 12, 2008
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging structure and method of an image sensor module
- Publication number 20070195188
- Publication date Aug 23, 2007
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure and method of an image sensor module
- Publication number 20060030070
- Publication date Feb 9, 2006
- Industrial Technology Research Institute
- Fang-Jun Leu
- H01 - BASIC ELECTRIC ELEMENTS